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Amphenol Communications Solutions |
Part No. |
L177HRA26SVF
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Description |
Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell, 26 Socket, 4-40 Fixed Front Screwlock
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Tech specs |
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Official Product Page
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Kondenshi Corp KODENSHI CORP.
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Part No. |
K4N30
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Description |
Photocoupler(These Photocouplers cosist of a Gallium Arsenide Infrared Emitting)
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File Size |
234.70K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
L77HDA26SOL2
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDA26SD1CH4R
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 26 Socket, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDA26SD1CH3FC309
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 26 Socket, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDA26SD1CO4F
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 26 Socket, 0.38um (15u\\) Gold, 4-40 Front Screwlock, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDA26SVF
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDA26SOL2
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDA26SD1CH4F
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 26 Socket, Flash Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDA26SD1CO3F
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 26 Socket, 0.38um (15u\\) Gold, M3 Front Screwlock, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDA26S
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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