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				Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc]
Part No.	BCP56T1 BCP56T1SERIES
OCR Text	...a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.0...
Description	MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT 中功率NPN硅高当前的晶体管表面贴装
File Size	200.38K / 6 Page	View it Online	Download Datasheet

				Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BCP68T1
OCR Text	...a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.0...
Description	MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT
File Size	149.51K / 6 Page	View it Online	Download Datasheet

				Motorola, Inc. Motorola Inc ON Semi MOTOROLA[Motorola, Inc]
Part No.	DTC114TE DTC114TE_D ON0280
OCR Text	...a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.0...
Description	CASE 463-01/ STYLE 1 SOT-416/SC-90 CASE 463-01, STYLE 1 SOT-416/SC-90 CASE 463-1, STYLE 1 SOT-16/SC-0 From old datasheet system
File Size	91.91K / 4 Page	View it Online	Download Datasheet

				Motorola Inc ON Semi MOTOROLA[Motorola, Inc]
Part No.	DTC114YE DTC114YE_D ON0281
OCR Text	...a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.0...
Description	CASE 463-01/ STYLE 1 SOT-416/SC-90 CASE 463-01, STYLE 1 SOT-416/SC-90 CASE 463-1, STYLE 1 SOT-16/SC-0 From old datasheet system
File Size	144.99K / 6 Page	View it Online	Download Datasheet

				HITACHI[Hitachi Semiconductor]
Part No.	HA16103 HA16103FPJ HA16103FPK
OCR Text	... 160 140 120 100 80 SOP20 using paste containing compound SOP20 without compound 40 mm Board 0.8 t ceramic or 1.5 t epoxy (1) (2) (3) 0.5 1 2 5 10 20 (1) (2) (3) Board thermal conductivity (W/mC) Glas...
Description	Watchdog Timer
File Size	104.49K / 21 Page	View it Online	Download Datasheet

				HITACHI[Hitachi Semiconductor] Hitachi America
Part No.	HA17723 HA17723F HA17723P
OCR Text	... 160 140 120 100 80 SOP14 using paste containing compound 1 2 3 SOP14 without compound 40 mm Board 0.8 t ceramic or 1.5 t epoxy 0.5 (1) (2) (3) 1 2 5 10 20 Board thermal conductivity (W/mC) Glass epoxy board w...
Description	Precision Voltage Regulator Analog IC - Datasheet Reference From old datasheet system
File Size	90.18K / 17 Page	View it Online	Download Datasheet

				Vicor, Corp. IXYS[IXYS Corporation]
Part No.	IXKF40N60SCD1
OCR Text	...= 1.8 with heat transfer paste CoolMOS is a trademark of IXYS reserves the right to change limits, test conditions and dimensions. Infineon Technologies AG. (c) 2002 IXYS All rights reserved 1-2 212 IXKF 40N60SCD...
Description	CONN 60POS .1X.1 IDC RIBBON PCB 38 A, 600 V, 0.07 ohm, N-CHANNEL, Si, POWER, MOSFET CoolMOS Power MOSFET with Series Schottky Diode and Ultra Fast Antiparallel Diode in High Voltage ISOPLUS i4-PAC
File Size	31.92K / 2 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc]
Part No.	MMQA5V6T1 MMQA20VT1 ON2242
OCR Text	...a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of brass or stainless steel. For packages such as the ...
Description	SC-59 QUAD TRANSIENT VOLTAGE SUPPRESSOR 5.6 VOLTS 24 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE From old datasheet system
File Size	136.87K / 8 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. Motorola, Inc. MOTOROLA[Motorola Inc] ONSEMI[ON Semiconductor]
Part No.	MSB709RT1 MSB709-RT1 ON2370
OCR Text	...a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.0...
Description	PNP General Purpose Amplifier Transistor Surface Mount 100 mA, 25 V, PNP, Si, SMALL SIGNAL TRANSISTOR From old datasheet system
File Size	111.84K / 4 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	PCF8577C PCF8577CP PCF8577CT PCF8577CU_10
OCR Text	...line packages By wave By solder paste reflow Repairing soldered joints (by hand-held soldering iron or pulse-heated solder tool) DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS PCF8577C 1998 Jul 30 2 Phi...
Description	LCD direct/duplex driver with I2C-bus interface
File Size	174.96K / 28 Page	View it Online	Download Datasheet

For paste Found Datasheets File :: 2807 Search Time::2.422ms
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