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  poly-silicon Datasheet PDF File

For poly-silicon Found Datasheets File :: 649    Search Time::1.578ms    
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    SGS Thomson Microelectronics
Part No. AN900
OCR Text ...to be etched. for instance, the poly gates of a transistor are obtained by etching the poly layer. a second example are the aluminium connec...silicon chips are grouped on a silicon wafer (in the same way postage stamps are printed on a single...
Description MCUS - INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY

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    CREE POWER
Part No. W4NRD0X-0000 W4NRD8C-U000 W4NXD8C-0000 W4NXD8C-L000 W4NXD8D-0000 W4NXD8C-S000 W4NXD8D-S000 W4NXD8G-0000 W6NRE0X-0000 W6NRD0X-0000 W6PXD3O-0000 W6NXD3L-0000 W6NXD0K-0000 W6NXD3K-0000
OCR Text ...wafer crystallography which are poly- crystalline or of a different polytype material than the remainder of the wafer, such as 4h mixed in w...silicon carbide are defined as linear crystallographic defects extending down from the surface of th...
Description Diameter: 50.8mm; LCW substrates; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; ultra-low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; select mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 76.2mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition

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    AT89C51RB2

ATMEL Corporation
Part No. AT89C51RB2
OCR Text ...icon Number of Layers Thickness Poly 1 Thickness Poly 2 Metal Number of Layers Material: Layer 1 Thickness Layer 2 Thickness Layer 3 Thickness 2 1400A Amorphous 3200A 3 AlCu 5000A 5000A 8000A Passivation Material Thickness Oxide...
Description AT89C51RB2 / RC2 & T89C51IC2 QualPack

File Size 814.09K  /  23 Page

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    SGS Thomson Microelectronics
Part No. AN473
OCR Text ... to the wires (Ls, Ld, Lg), the poly-silicon gate resistance (Rg), the resistance due both to silicon and to bonding (Rs, Rd), the body-drain capacitance modulation (DBD) and the leakage current when the device is in breakdown. Two points n...
Description A NEW APPROACH TO PARAMETER EXTRACTION FOR THE SPICE POWER MOSFET MODEL

File Size 42.97K  /  7 Page

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    ST Microelectronics
Part No. LIS2L01
OCR Text ...rocess called ThELMA (Thick Epi-Poly layer for Microactuators and Accelerometers) developed by ST to produce inertial sensor and actuator in silicon. The IC interface instead is manufactured using a CMOS process that allow high level of int...
Description INERTIAL SENSOR

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    ANALOG DEVICES INC
Part No. ADXL203BE-REEL
OCR Text ...ccelerom eter. they contain a poly s ilicon surface-m i crom achined sensor and signal conditioning circuitry to im plem ent an open loo...silicon wafer. poly silicon springs suspend t h e s t r u c t u r e over the surface of the waf...
Description SPECIALTY ANALOG CIRCUIT, QCC8

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    SGS Thomson Microelectronics
STMICROELECTRONICS[STMicroelectronics]
Part No. LIS2L01
OCR Text ...rocess called ThELMA (Thick Epi-Poly layer for Microactuators and Accelerometers) developed by ST to produce inertial sensor and actuator in silicon. The IC interface instead is manufactured using a CMOS process that allow high level of int...
Description SPECIALTY ANALOG CIRCUIT, PDSO24
INERTIAL SENSOR: 2AXIS/1G LINEAR ACCELEROMETER
INERTIAL SENSOR : 2Axis/1g LINEAR ACCELEROMETER

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    LIS3L02AS 9322

意法半导
ST Microelectronics
STMicroelectronics
Part No. LIS3L02AS 9322
OCR Text ...rocess called THELMA (Thick Epi-Poly Layer for Microactuators and Accelerometers) developed by ST to produce inertial sensors and actuators in silicon. The IC interface instead is manufactured using a CMOS process that allows high level of ...
Description INERTIAL SENSOR: 3AXIS - 2G/6G LINEAR ACCELEROMETER
INERTIAL SENSOR: 2AXIS - 2G/6G LINEAR ACCELEROMETER
From old datasheet system
INERTIAL SENSOR: 3Axis - 2g/6g LINEAR ACCELEROMETER

File Size 79.34K  /  7 Page

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For poly-silicon Found Datasheets File :: 649    Search Time::1.578ms    
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