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  533-3742 Datasheet PDF File

For 533-3742 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Atmel Corp.
Part No. ATA3742
Description UHF ASK/FSK Receiver

File Size 378.82K  /  34 Page

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Analog Devices

Part No. LT3742EUF#TRPBF
Description 2x, 2-PhBuck Sw Cntr
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    FLM3742-25F

List of Unclassifed Manufacturers
ETC
Part No. FLM3742-25F
Description C-BAND INTERNALLY MATCHED FET

File Size 292.46K  /  4 Page

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Analog Devices

Part No. LT3742EUF#PBF
Description 2x, 2-PhBuck Sw Cntr
Tech specs    

Official Product Page

    FLM3742-12F

Eudyna Devices Inc
Part No. FLM3742-12F
Description C-Band Internally Matched FET

File Size 291.98K  /  4 Page

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Renesas Electronics Corporation

Part No. UPD70F3742GC-UEU-AX
Description 32-bit Microcontrollers
Tech specs    

Official Product Page

    FLM3742-18F

Eudyna Devices Inc
Part No. FLM3742-18F
Description C-Band Internally Matched FET

File Size 293.23K  /  4 Page

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Renesas Electronics Corporation

Part No. UPD70F3742GC(R)-UEU-AX
Description 32-bit Microcontrollers
Tech specs    

Official Product Page

    TIM3742-4SL

Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM3742-4SL
Description MICROWAVE POWER GAAS FET

File Size 121.66K  /  4 Page

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Renesas Electronics Corporation

Part No. UPD70F3742GC(S)-UEU-AX
Description 32-bit Microcontrollers
Tech specs    

Official Product Page

    TIM3742-8UL

Toshiba Corporation
Toshiba Semiconductor
Part No. TIM3742-8UL
Description MICROWAVE POWER GaAs FET

File Size 68.81K  /  4 Page

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Amphenol Communications Solutions

Part No. 86837-428HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, 9.65 mm (0.38 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    TIM3742-8SL

Toshiba Semiconductor
Part No. TIM3742-8SL
Description MICROWAVE POWER GaAs FET

File Size 123.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 86837-422HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 9.65 mm (0.38 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    TIM3742-4UL

Toshiba Semiconductor
Part No. TIM3742-4UL
Description MICROWAVE POWER GaAs FET

File Size 168.29K  /  4 Page

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Amphenol Communications Solutions

Part No. L17DM53742
Description Dsub, Straight, Shielded Coax Contact, Socket, 0.38m(15 in) Gold Signal Pin, Flash Gold Shield, Cable 178 B/U, 50Ohm, Inner Soldercup/ Crimp Ferrule
Tech specs    

Official Product Page

    TIM3742-4SL-341

Toshiba Semiconductor
Part No. TIM3742-4SL-341
Description MICROWAVE POWER GaAs FET

File Size 131.97K  /  4 Page

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Amphenol Communications Solutions

Part No. DM537425006NCLF
Description DSUB COAX CONTACT-842-CF-215-1313
Tech specs    

Official Product Page

    TIM3742-8SL-341

Toshiba Semiconductor
Part No. TIM3742-8SL-341
Description IM3=-45 dBc at Pout= 28.5dBm Single Carrier Level

File Size 242.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 86837-424HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 9.65 mm (0.38 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

For 533-3742 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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