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  87758-0416 Datasheet PDF File

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    87758-1817

Molex Electronics Ltd.
Part No. 87758-1817
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.70K  /  4 Page

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Analog Devices

Part No. 110416-HMC452ST89
Description HMC452ST89 Evaluation PCB, 470
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87758-2017

Molex Electronics Ltd.
Part No. 87758-2017
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Analog Devices

Part No. EVAL-CN0416-ARDZ
Description Isolated and non-isolated RS-4
Tech specs    

Official Product Page

    87758-2050

Molex Electronics Ltd.
Part No. 87758-2050
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits

File Size 135.92K  /  4 Page

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Renesas Electronics Corporation

Part No. R1LV0416DBG-7LI#S0
Description Low Power SRAM, TFBGA, /Embossed Tape
Tech specs    

Official Product Page

    87758-2016

Molex Electronics Ltd.
Part No. 87758-2016
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Renesas Electronics Corporation

Part No. RMLV0416EGBG-4S2#KC0
Description 4Mb Advanced LPSRAM (256-kword × 16-bit)
Tech specs    

Official Product Page

    87758-1616

Molex Electronics Ltd.
Part No. 87758-1616
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.38um (15u) Gold (Au) Selective Plating

File Size 170.71K  /  4 Page

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Renesas Electronics Corporation

Part No. RMLV0416EGSB-4S2#HA0
Description 4Mb Advanced LPSRAM (256-kword x 16-bit), TSOP(44), /Embossed Tape
Tech specs    

Official Product Page

    87758-1217

Molex Electronics Ltd.
Part No. 87758-1217
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Renesas Electronics Corporation

Part No. R1RW0416DSB-0PI#S0
Description Wide Temperature Range Version 4M High-speed SRAM (256-kword x 16-bit), TSOP(44), /Embossed Tape
Tech specs    

Official Product Page

    87758-3416

Molex Electronics Ltd.
Part No. 87758-3416
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 34 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.43K  /  4 Page

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Renesas Electronics Corporation

Part No. R1LV0416DSB-7LI#S0
Description Low Power SRAM, TSOP(2), /Embossed Tape
Tech specs    

Official Product Page

    87758-3816

Molex Electronics Ltd.
Part No. 87758-3816
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.43K  /  4 Page

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Renesas Electronics Corporation

Part No. R1LV0416DBG-7LI#B0
Description Low Power SRAM, TFBGA, /Tray
Tech specs    

Official Product Page

    87758-3616

Molex Electronics Ltd.
Part No. 87758-3616
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 36 Circuits

File Size 170.71K  /  4 Page

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Renesas Electronics Corporation

Part No. R1LV0416DSB-7LI#B0
Description Low Power SRAM, TSOP(2), /Tray
Tech specs    

Official Product Page

    87758-3417

Molex Electronics Ltd.
Part No. 87758-3417
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.42K  /  4 Page

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Renesas Electronics Corporation

Part No. R1RW0416DSB-0PR#S1
Description 4M High-speed SRAM (256-kword × 16-bit)
Tech specs    

Official Product Page

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