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ST Microelectronics
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Part No. |
ST23R160
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Description |
ST23 Dual Interface Secure MCU with 160 KBytes EEPROM, enhanced security and Nescrypt cryptoprocessor, RF type B (Contectless High end ID-Passport/PKI)
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File Size |
173.85K /
4 Page |
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it Online |
Download Datasheet |
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Winbond Electronics Corp
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Part No. |
W6662CF
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Description |
CCD(Correlated Double Sampler)/CIS(Contact Image Sensors) Analog Front End Signal Processor.(耦合采样器/接触图象传感器模拟前端信号处理器)
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File Size |
273.64K /
19 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
73810-1218
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Description |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits 2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
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File Size |
164.68K /
4 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
73810-1204 0738101204
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Description |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits 2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
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File Size |
164.69K /
4 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
73810-1206 0738101206
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Description |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits 2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
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File Size |
164.68K /
4 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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