HM15-20150 pdf Datasheet P3 Part Num --- IC-ON-LINE


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HM15-20150 Datasheet PDF File

For HM15-20150 Found Datasheets File :: 150+ Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

					BI Technologies Corporation BI Technologies, Corp.
Part No.	HM15-10150LF HM15-10220LF HM15-10330LF HM15-10470LF HM15-10680LF HM15-10820LF HM15-11000LF HM15-20150LF HM15-20220LF HM15-20330LF HM15-20470LF HM15-20820LF
Description	Encapsulated Low Power Inductors 1 ELEMENT, 820 uH, GENERAL PURPOSE INDUCTOR
File Size	311.22K / 1 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	TPS728120150DRVR
Description	Single Output LDO, 200mA, Dual Level Fixed with Vset Pin 6-WSON -40 to 125
Tech specs				Official Product Page

HUA FENG CIRCUIT

					TDK Electronics
Part No.	HHM1522A7
Description	Multilayer Chip Baluns For AGSM/Tx & Rx Multilayer Chip Baluns For AGSM/Tx & Rx
File Size	38.53K / 2 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	TPS728120150DRVT
Description	Single Output LDO, 200mA, Dual Level Fixed with Vset Pin 6-WSON -40 to 125
Tech specs			Get Free Sample	Official Product Page

					TDK Electronics
Part No.	HHM1523B3
Description	Multilayer Chip Baluns For AGSM/Tx & Rx
File Size	38.68K / 2 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	R2A20150SA
Description	8-bit I/O Expander for I<sup>2</sup>C BUS (Corresponds to Fast mode), TSSOP, /Tape & Reel
Tech specs				Official Product Page

					TDK Electronics
Part No.	HHM1518A3
Description	Multilayer Chip Baluns For DCS-PCS/Tx & Rx
File Size	38.71K / 2 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	R2A20150SA#W5
Description	8-bit I/O Expander for I²C BUS (Corresponds to Fast mode)
Tech specs				Official Product Page

					TDK Electronics
Part No.	HHM1518A3-15
Description	Multilayer Balun
File Size	67.70K / 6 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	R2A20150NP#W5
Description	Converters
Tech specs				Official Product Page

					TDK Electronics
Part No.	HHM1583B1
Description	Multilayer Chip Baluns For UWB
File Size	42.26K / 2 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	R2A20150NP
Description	Converters, HWQFN, /Tape & Reel
Tech specs				Official Product Page

					TDK Electronics
Part No.	HHM1522B1-15
Description	Multilayer Balun
File Size	67.97K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-109201500LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					TDK Electronics
Part No.	HHM1515B2-15
Description	Multilayer Balun
File Size	67.16K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	61082-201509LF
Description	BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs				Official Product Page

					TDK Electronics
Part No.	HHM1520A2 HHM1520-15
Description	Multilayer Balun
File Size	67.66K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59202-T40-20-150LF
Description	Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs				Official Product Page

					TDK Electronics
Part No.	HHM1522A7-15
Description	Multilayer Balun
File Size	67.65K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-108201500LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

For HM15-20150 Found Datasheets File :: 150+ Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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