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Winbond Electronics Corp America
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Part No. |
W56932CY
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Description |
This series of chips is designed for the ringtone application of mobile phones with MIDI music and A
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File Size |
296.34K /
3 Page |
View
it Online |
Download Datasheet |
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SIEMENS AG Infineon SIEMENS[Siemens Semiconductor Group]
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Part No. |
CLY2 Q62702-L96
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Description |
GaAs FET (Power amplifier for mobile phones For frequencies up to 3 GHz) 砷化镓场效应管(功放为频率高千兆赫移动电话) From old datasheet system
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File Size |
52.08K /
7 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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