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GP1A16R 10A12 P973T T3524 QS53806 62004 000WD 09S1MNZ
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    ACPM-5013 ACPM-5013-BLK ACPM-5013-TR1

AVAGO TECHNOLOGIES LIMITED
Part No. ACPM-5013 ACPM-5013-BLK ACPM-5013-TR1
OCR Text ...tion solder mask opening solder paste stencil aperture pcb design guidelines the recommended pcb land pattern is shown in figures on the left side. the substrate is coated with solder mask between the i/o and conductive paddle to protect ...
Description 3 x 3 mm Power Amplifier Module LTE Band13/14 (777-798 MHz)

File Size 286.46K  /  14 Page

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    ACPM-5011 ACPM-5011-BLK

AVAGO TECHNOLOGIES LIMITED
Part No. ACPM-5011 ACPM-5011-BLK
OCR Text ...tion solder mask opening solder paste stencil aperture pcb design guidelines the recommended pcb land pattern is shown in fgures on the left side. the substrate is coated with solder mask between the i/o and conductive paddle...
Description UMTS/LTE Band11 Band21 (1427.9 - 1462.9 MHz) 3 x 3 mm Power Amplifier Module

File Size 804.61K  /  13 Page

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    ACPM-5008-BLK ACPM-5008-TR1

AVAGO TECHNOLOGIES LIMITED
Part No. ACPM-5008-BLK ACPM-5008-TR1
OCR Text ...tion solder mask opening solder paste stencil aperture pcb design guidelines the recommended pcb land pattern is shown in fi gures on the left side. the substrate is coated with solder mask between the i/o and conductive paddle to protec...
Description UMTS Band8 (880-915MHz) 3x3mm Power Amplifi er Module

File Size 312.19K  /  13 Page

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    ACPM-5007 ACPM-5007-BLK ACPM-5007-TR1

AVAGO TECHNOLOGIES LIMITED
Part No. ACPM-5007 ACPM-5007-BLK ACPM-5007-TR1
OCR Text ...tion solder mask opening solder paste stencil aperture pcb design guidelines the recommended pcb land pattern is shown in fi gures on the left side. the substrate is coated with solder mask between the i/o and conductive paddle to protec...
Description LTE Band7 (2500-2570 MHz) 3 x 3 mm Power Amplifi er Module

File Size 301.07K  /  13 Page

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    ACPM-5004-BLK ACPM-5004-TR1

AVAGO TECHNOLOGIES LIMITED
Part No. ACPM-5004-BLK ACPM-5004-TR1
OCR Text ...tion solder mask opening solder paste stencil aperture pcb design guidelines the recommended pcb land pattern is shown in figures on the left side. the substrate is coated with solder mask between the i/o and conductive paddle to protect ...
Description Multimode PA - UMTS 1700MHz PA (1710-1785MHz) 3x3mm Power Amplifier Module with Coupler

File Size 278.35K  /  13 Page

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    ACPM-5002-BLK ACPM-5002-TR1

AVAGO TECHNOLOGIES LIMITED
Part No. ACPM-5002-BLK ACPM-5002-TR1
OCR Text ...tion solder mask opening solder paste stencil aperture pcb design guidelines the recommended pcb land pattern is shown in fi gures on the left side. the substrate is coated with solder mask between the i/o and conductive paddle to protec...
Description Multimode PA - UMTS Band2, LTE Band25 and CDMA PCS 3x3mm Power Amplifi er Module with Coupler

File Size 311.82K  /  13 Page

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    ACPM-5001-BLK ACPM-5001-TR1

AVAGO TECHNOLOGIES LIMITED
Part No. ACPM-5001-BLK ACPM-5001-TR1
OCR Text ...tion solder mask opening solder paste stencil aperture pcb design guidelines the recommended pcb land pattern is shown in figures on the left side. the substrate is coated with solder mask between the i/o and conductive paddle to protect ...
Description Multimode PA - UMTS Band1 and CDMA IMT (1920-1980MHz) 3x3mm Power Amplifier Module with Coupler

File Size 277.49K  /  13 Page

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    Spreadtrum
Part No. QS518
OCR Text .................. 3 3. solder paste................................................................................................................... ................................... 3 4. reflow profile ..............................
Description Solder Profile and Stencil Design

File Size 119.34K  /  6 Page

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    500R07S0R2AV4T

Johanson Technology Inc.
Part No. 500R07S0R2AV4T
OCR Text ...ting the circuit so that solder paste reflows, or ?wetting? of the ceramic capacitor and pcb contacts occurs. these methods include infra-red, convection and radiant heating. the size of the solder fillet may be controlled by varying ...
Description APPLICATION NOTES FOR CERAMIC CHIP CAPACITORS

File Size 69.24K  /  3 Page

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    U1206C220CCT U1206C220GCT U1206C220DCT U1206C220JCT U1206R220CCT U1206R220FCT U1206R220GCT U1206R220JCT U1206C220FCT U12

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Part No. U1206C220CCT U1206C220GCT U1206C220DCT U1206C220JCT U1206R220CCT U1206R220FCT U1206R220GCT U1206R220JCT U1206C220FCT U1206C220BCT U1206R220DCT T1206R220BCT T1206R220CCT T1206R220JCT T1206C220CCT T1206C220FCT T1206R220FCT T1206C220BCT T1206C220DCT T1206C220GCT T1206R220DCT T1206R220GCT T1206C220JCT A0603F220BCT A0603F220GCT U0603F220GCT U0603F220BCT T0603F220GCT B0603F220JCT A0603F220JCT T0603F220JCT U0603F220JCT V0603F220GCT T0603F220BCT B0603F220GCT V0603F220BCT V0603F220JCT T0805R220BCT T0805R220CCT T0805R220DCT T0805R220GCT T0805R220FCT T0805R220JCT U0603C220BCT U0603C220CCT U0603C220DCT U0603C220GCT U0603C220JCT U0603R220DCT U0603R220GCT U0603R220JCT U0603C220FCT U0603R103KCT U0603R220BCT U0603R220CCT U0603R220FCT A0603C220BCT A0603C220CCT A0603R220CCT A0603R220FCT A0603R220DCT A0603R220JCT A0603C220FCT A0603C220JCT A0603C220GCT A0603R220BCT A0603R220GCT U1206F220BCT U1206F220GCT U1206F220JCT T1206F220BCT T1206F220GCT T1206F220JCT U0805C220GCT U0805C220DCT U0805C220FCT U0805F220JCT U0805R220CCT U0805C220BCT U0805C220JCT U0805R220BCT B0603C220DCT B0603C220BCT B0603C220CCT B0603C220GCT B0603C220FCT B0603R220DCT B0603R220FCT B0603R220CCT B0603R220JCT T0603C220BCT T0603C220DCT T060
OCR Text ...on smt against lead-free solder paste, but also suitable against lead- containing solder paste. if the optimized solder joint is requested, increasing soldering time, temperature and concentration o f n2 within oven are recommended. recomme...
Description Multilayer Ceramic Capacitors
   Multilayer Ceramic Capacitors

File Size 355.39K  /  4 Page

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