...ing, the FDZ202P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the dev...solder BALL, O 0.30 0.25 C L
solder BALL O 0.30 GATE FRONT VIEW INDEX SLOT (HIDDEN)
D
1.95
...
...ing, the FDZ203N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the dev...solder ball, RJB, is defined for reference. For RJC, the thermal reference point for the case is def...
...ing, the FDZ204P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the dev...solder ball, RJB, is defined for reference. For RJC, the thermal reference point for the case is def...
...ing, the FDZ206P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the dev...solder ball, RJB, is defined for reference. For RJC, the thermal reference point for the case is def...
...4.5 V * Occupies only 14 mm2 of PCB area. Only 42% of the area of SO-8 * Ultra-thin package: less than 0.80 mm height when mounted to PCB * ...solder ball, RJB, is defined for reference. For RJC, the thermal reference point for the case is def...
...ing, the FDZ209N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the dev...solder ball, RJB, is defined for reference. For RJC, the thermal reference point for the case is def...
...s flexibility and creativity to PCB design especially when board space is at a premium. Two simplified examples of MMQA5V6T1 and MMQA20VT1 a...solder connection inter0.094 2.4
face between the board and the package. With the correct pad geo...
Description
SC-59 QUAD TRANSIENT VOLTAGE SUPPRESSOR 5.6 VOLTS 24 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE From old datasheet system