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X9312TSI BH141 SP7125 X9312ZP RD43E 52203 C6707 60030
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    Integrated Device Techn...
Part No. IDT5V41236
OCR Text ...his includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. external components a minimum number of external components are required for proper operation. decoupling capacitor...
Description    4 OUTPUT PCIE GEN1/2/3 SYNTHESIZER

File Size 319.35K  /  18 Page

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    Powerex Power Semicondu...
Part No. CP20TD1-12A
OCR Text ...ration. **t c is measured just underneath the power chip. ***pulse width and repetition rate should be such that the device junction temperature (t j ) does not exceed t j(max.) rating. ****i e , v ec , t rr , and q rr represent characte...
Description    DIP-CIB 20 Amperes/600 Volts

File Size 270.19K  /  6 Page

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    Integrated Device Techn...
Part No. IDT5V41068A
OCR Text ...his includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. external components a minimum number of external components are required for proper operation. decoupling capacitor...
Description 16-pin TSSOP package

File Size 178.97K  /  13 Page

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    Integrated Device Techn...
Part No. IDT5V41067A
OCR Text ...his includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. external components a minimum number of external components are required for proper operation. decoupling capacitor...
Description 20-pin TSSOP package

File Size 187.52K  /  13 Page

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    EL4393 EL4393C EL4393CM EL4393CN

ELANTEC[Elantec Semiconductor]
Part No. EL4393 EL4393C EL4393CM EL4393CN
OCR Text ...pins The ground plane should be underneath the package but cut away from the In b inputs Care should be taken with the center channel feedback it must be kept away from any of the in a or in b pins if it has to go under the package Route th...
Description Triple 80 MHz Video Amplifier w/Disable

File Size 256.84K  /  12 Page

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