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vias Datasheet PDF File

For vias Found Datasheets File :: 5126 Search Time::0.813ms
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				ON Semiconductor
Part No.	NCV7719DQR2G
OCR Text	... be isolated from any traces or vias on the pcb board. 10 out6 half?bridge output 6 11 out4 half?bridge output 4 12 gnd ground 13 gnd ground 14 out3 half?bridge output 3 15 nc no connection. this pin should be isolated from any traces or vi...
Description	Octal Half-Bridge Driver
File Size	239.23K / 26 Page	View it Online	Download Datasheet

				WJCI[WJ Communication. Inc.]
Part No.	AH11PP900-PCB AH11 AH11BAL-PCB AH11-G AH11PP1900-PCB
OCR Text	...(C) 110 9. Ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80/.0135") diameter drill and have a final plated through diameter of .25mm (.010") Add as much copper as possible to inn...
Description	High Dynamic Range Dual Amplifier
File Size	313.95K / 6 Page	View it Online	Download Datasheet

				http:// FAIRCHILD[Fairchild Semiconductor] Fairchild Semiconductor Corporation
Part No.	AN-5026
OCR Text	...3-bit switch without the use of vias. Routing Power and Ground: Power and ground balls have not been routed in the illustrations above because of the designers multiple routing choices. There are generally two methods: 1. Supplying power...
Description	Using BGA Packages Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:15-19 RoHS Compliant: No
File Size	720.16K / 8 Page	View it Online	Download Datasheet

				United Monolithic Semicondu... UMS[United Monolithic Semiconductors]
Part No.	CHA2066RBF_24 CHA2066RBF CHA2066RBF/24
OCR Text	...a grid of plenty plated through vias with a diameter of less than 200m [8 mils] and a spacing of less than 400m [16 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias clo...
Description	10-16GHz Self biased Low Noise Amplifier
File Size	179.82K / 8 Page	View it Online	Download Datasheet

				United Monolithic Semicondu... UMS[United Monolithic Semiconductors] United Monolithic Semiconductors GmbH
Part No.	CHA2069RAF_24 CHA2069RAF CHA2069RAF/24
OCR Text	...a grid of plenty plated through vias with a diameter of less than 200m [8 mils] and a spacing of less than 400m [16 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias clo...
Description	Circular Connector; No. of Contacts:100; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:23; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:23-35 RoHS Compliant: No 18-31GHz Low Noise Amplifier 18 - 31GHz之间低噪声放大器
File Size	169.36K / 7 Page	View it Online	Download Datasheet

				United Monolithic Semiconductors GmbH UMS[United Monolithic Semiconductors]
Part No.	CHA5093TCF_24 CHA5093TCF CHA5093TCF/24
OCR Text	...a grid of plenty plated through vias with a diameter of less than 200m [8 mils] and a spacing of less than 400m [16 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias clo...
Description	24-26GHz High Power Amplifier 24 - 26GHz高功率放大器
File Size	151.10K / 6 Page	View it Online	Download Datasheet

				United Monolithic Semic... UMS[United Monolithic Semiconductors] United Monolithic Semiconductors GmbH
Part No.	CHA5390TBF_24 CHA5390TBF CHA5390TBF/24
OCR Text	...a grid of plenty plated through vias with a diameter of less than 200m [8 mils] and a spacing of less than 400m [16 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias clo...
Description	24-30GHz Medium Power Amplifier 24 - 30GHz的中等功率放大器
File Size	167.02K / 6 Page	View it Online	Download Datasheet

For vias Found Datasheets File :: 5126 Search Time::0.813ms
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