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Xilinx
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| Part No. |
4FG676I
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| OCR Text |
... and Wire-Bond Ball Grid Array (BGA) packages in three standard fine pitches (0.80mm, 1.00mm, and 1.27mm) 100% factory tested -
SelectRAM...680 10,752 14,336 23,040 33,792 46,592
DCMs 4 4 8 8 8 8 8 12 12 12 12
XC2V1500 XC2V2000 XC2V30... |
| Description |
Search --To XC2V1000-4FG676I
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| File Size |
148.56K /
7 Page |
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Sanyo Semiconductor
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| Part No. |
LA71170M
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| OCR Text |
...C APC APC AFC ID DET
P R
PB BGA BEFORE
BEFORE AFTER
1k
Y DELAY
45
87
HEAD AMP H.A.
PB BGA AFTER REC BGA
R P
44 P ...680
180
AUDIO MUTE C ROT IN
+
33k
HA SW IN
RF SW IN
4.7
330
820p
56
... |
| Description |
VHS video Y/C/A in a single chip
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| File Size |
511.06K /
34 Page |
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it Online |
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Fujitsu, Ltd.
Fujitsu Limited
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| Part No. |
CE71L5 CE71JE CE71L9 CE71J3 CE71TC
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| OCR Text |
...* Packaging options: QFP, HQFP, BGA, TBGA * Support for major third-party EDA tools * * * * * * * *
PCI
Fixed Layout Soft Macro
t
Em...680 728 808 920 1,008
Signals
152 152 178 206 264 304 360 360 360 472 472 506 506 506 506 506
... |
| Description |
0.25um CMOS Technology 0.25微米CMOS工艺
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| File Size |
53.19K /
4 Page |
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it Online |
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OKI SEMICONDUCTOR CO., LTD.
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| Part No. |
MSM5052-XXXGS-BK MSM5052-XXXGS-2K MSM5052-XXXGS-K
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| OCR Text |
... tsop, soj, qfj (plcc), shp and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales perso... |
| Description |
Built-in Temperature Circuit and LCD Driver 4-Bit Microcontroller
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| File Size |
127.71K /
12 Page |
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it Online |
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Silicon Laboratories Inc.
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| Part No. |
SI5100-H-BL SI5100-G-BC
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| OCR Text |
...ply 1.8 v operation 15 x 15 mm bga package sonet/sdh transmission systems optical transceiver modules sonet/sdh test equipment txclkou...680 760 760 830 ma power dissipation p d full duplex line/diagnostic loopback ?1.2 1.4 1.4 1.6 w vo... |
| Description |
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| File Size |
360.02K /
40 Page |
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it Online |
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Xilinx, Inc.
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| Part No. |
XC2V10000 XC2V2000
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| OCR Text |
... and wire-bond ball grid array (bga) packages in three standard fine pitches (0.80mm, 1.00mm, and 1.27mm) 100% factory tested 0 virtex-i...680 240 48 48 864 8 528 xc2v2000 2m 56 x 48 10,752 336 56 56 1,008 8 624 xc2v3000 3m 64 x 56 14,336 ... |
| Description |
Virtex-II 1.5V Field-Programmable Gate Arrays(Virtex-II 1.5V 现场可编程门阵列) 的Virtex - II 1.5V的现场可编程门阵列（的Virtex - II 1.5V的现场可编程门阵列）
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| File Size |
99.69K /
8 Page |
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it Online |
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