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  HM15-10820 Datasheet PDF File

For HM15-10820 Found Datasheets File :: 90+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 |   

    HHM1520A2 HHM1520-15

TDK Electronics
Part No. HHM1520A2 HHM1520-15
Description Multilayer Balun

File Size 67.66K  /  6 Page

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Coilcraft Inc

Part No. RFB0810-820L
Description General Purpose Inductor, 82uH, 10%, 1 Element, Ferrite-Core, ROHS COMPLIANT
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HHM1518A3

TDK Electronics
Part No. HHM1518A3
Description Multilayer Chip Baluns For DCS-PCS/Tx & Rx

File Size 38.71K  /  2 Page

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Coilcraft Inc

Part No. RFB1010-820L
Description General Purpose Inductor, 82uH, 10%, 1 Element, Ferrite-Core, ROHS COMPLIANT
Tech specs    

Official Product Page

    HHM1523B3

TDK Electronics
Part No. HHM1523B3
Description Multilayer Chip Baluns For AGSM/Tx & Rx

File Size 38.68K  /  2 Page

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Renesas Electronics Corporation

Part No. TSI108-200CL
Description Host Bridge
Tech specs    

Official Product Page

    HHM1522A7

TDK Electronics
Part No. HHM1522A7
Description Multilayer Chip Baluns For AGSM/Tx & Rx
   Multilayer Chip Baluns For AGSM/Tx & Rx

File Size 38.53K  /  2 Page

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Renesas Electronics Corporation

Part No. TSI108-200CLY
Description Host Bridge
Tech specs    

Official Product Page

    HHM1570B1

TDK Electronics
Part No. HHM1570B1
Description MULTILAYER BALUN SPECIFICATION

File Size 47.02K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-108201000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HHM1583B1

TDK Electronics
Part No. HHM1583B1
Description Multilayer Chip Baluns For UWB

File Size 42.26K  /  2 Page

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Amphenol Communications Solutions

Part No. 61082-041502PLF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
Tech specs    

Official Product Page

    HHM1518A3-15

TDK Electronics
Part No. HHM1518A3-15
Description Multilayer Balun

File Size 67.70K  /  6 Page

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Amphenol Communications Solutions

Part No. 61082-062422PLF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
Tech specs    

Official Product Page

    HHM1522B1-15

TDK Electronics
Part No. HHM1522B1-15
Description Multilayer Balun

File Size 67.97K  /  6 Page

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Amphenol Communications Solutions

Part No. 61082-061406LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
Tech specs    

Official Product Page

    HHM1515B2-15

TDK Electronics
Part No. HHM1515B2-15
Description Multilayer Balun

File Size 67.16K  /  6 Page

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Amphenol Communications Solutions

Part No. 61082-063402PLF
Description 0.8MM Board to Board Receptacle
Tech specs    

Official Product Page

    HHM1506 HHM1533 HHM1534

TDK Electronics
Part No. HHM1506 HHM1533 HHM1534
Description Multilayer Balun Transformers For W-CDMA Tx & Rx
HHM Series

File Size 79.05K  /  9 Page

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Amphenol Communications Solutions

Part No. 61082-063409LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
Tech specs    

Official Product Page

For HM15-10820 Found Datasheets File :: 90+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 |   

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