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moulding Datasheet PDF File

For moulding Found Datasheets File :: 308 Search Time::1.89ms
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				List of Unclassifed Manufacturers List of Unclassifed Man...
Part No.	CTB04VY CTB04VY7 CTB04VY11 CTB04VY12 CTB04VY3 CTB04VY6 CTB04VY10 CTB04VY5 CTB04VY8 CTB04VZ CTB04VZ10 CTB04VY4 CTB04VY9 CTB04VZ11 CTB04VZ2 CTB04VZ3 CTB04VZ4 CTB04VZ6 CTB04VZ8
OCR Text	...ng temperature -20?c to 110?c moulding ul94-v0 flame retardant pa68 pin/terminal 5 tinned, nickel plated brass clamp zinc plated steel screw/torque m3 steel, 6 zinc colour passivated and tropicalised/0.5nm recommended pcb hol...
Description	6.35mm Pitch Power Terminal Rising Clamp Terminal
File Size	164.07K / 1 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRLI3103 2311
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	HEXFET Power MOSFET From old datasheet system HEXFET? Power MOSFET
File Size	150.05K / 8 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRLI3803 2315
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	30V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package HEXFET? Power MOSFET From old datasheet system
File Size	99.90K / 8 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRLI2203G 2307
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	HEXFET? Power MOSFET From old datasheet system
File Size	155.38K / 8 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRFI4905
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	HEXFET Power MOSFET HEXFET? Power MOSFET
File Size	113.77K / 8 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRFI1310G
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	100V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package HEXFET? Power MOSFET
File Size	177.18K / 8 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRFI1310N
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	Power MOSFET(Vdss=100V/ Rds(on)=0.036ohm/ Id=24A) HEXFET? Power MOSFET Power MOSFET(Vdss=100V, Rds(on)=0.036ohm, Id=24A)
File Size	100.77K / 8 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRFI3710
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	HEXFET Power MOSFET HEXFET? Power MOSFET
File Size	141.24K / 8 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRLI2203N 2308
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	30V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package HEXFET? Power MOSFET From old datasheet system
File Size	109.46K / 8 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRFI5210
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	HEXFET Power MOSFET
File Size	144.67K / 8 Page	View it Online	Download Datasheet

For moulding Found Datasheets File :: 308 Search Time::1.89ms
Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |