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TI store
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| Part No. |
CSD96497Q5MC CSD96497Q5MCT
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| OCR Text |
... is recommended that vias under paste be filled, plugged or tented. (0.05) typ 2x (1.13) 6x (1.32) 2x (0.31) 2x (2.85) (3.3) 20x (0.5) (4.7) 22x (0.25) 10x (0.7) (5.4) (r0.05) typ ( 0.2) via typ 6x (1.4) 2x (0.7) symm 1 6 7 12 symm land pa... |
| Description |
<font color=red>[Old version datasheet]</font> Synchronous buck NexFET smart power stage
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| File Size |
244.45K /
11 Page |
 View
it Online |
Download Datasheet
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TriQuint Semiconductor, Inc.
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| Part No. |
TGA2923-SG-T/R
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| OCR Text |
...mends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors? recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering i... |
| Description |
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| File Size |
406.47K /
12 Page |
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it Online |
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TriQuint Semiconductor,Inc.
TriQuint Semiconductor, Inc.
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| Part No. |
TGA2803-SM
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| OCR Text |
...mends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering is not ... |
| Description |
CATV TIA/Gain Block 40 MHz - 1000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
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| File Size |
216.52K /
11 Page |
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it Online |
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Infineon Technologies A...
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| Part No. |
FP25R12W2T4 FP25R12W2T4-13
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| OCR Text |
...heatsink proigbt/perigbt l paste =1w/(mk)/ l grease =1w/(mk) r thch 0,70 k/w temperaturimschaltbetrieb temperatureunderswitchingconditions t vj op -40 150 c
2 technischeinformation/technicalinformation fp... |
| Description |
IGBT-Module
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| File Size |
785.02K /
11 Page |
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it Online |
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TriQuint Semiconductor, Inc.
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| Part No. |
TGA2703-SM
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| OCR Text |
...mends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors? recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering i... |
| Description |
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| File Size |
742.81K /
15 Page |
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it Online |
Download Datasheet |
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TriQuint Semiconductor,Inc.
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| Part No. |
TGA2703-SM
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| OCR Text |
...mends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering is not ... |
| Description |
3.5GHz WiMAX Driver / Power Amplifier
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| File Size |
294.80K /
14 Page |
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it Online |
Download Datasheet |
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TriQuint Semiconductor, Inc.
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| Part No. |
TGA2513-SM
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| OCR Text |
...mends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors? recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering is... |
| Description |
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| File Size |
286.57K /
12 Page |
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it Online |
Download Datasheet |
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Infineon Technologies A...
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| Part No. |
FP25R12W2T4-B11 FP25R12W2T4-B11-13
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| OCR Text |
...heatsink proigbt/perigbt l paste =1w/(mk)/ l grease =1w/(mk) r thch 0,70 k/w temperaturimschaltbetrieb temperatureunderswitchingconditions t vj op -40 150 c
2 technischeinformation/technicalinformation fp... |
| Description |
EasyPIM2B Modul PressFIT mit Trench
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| File Size |
621.83K /
11 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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