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Amphenol Communications Solutions |
Part No. |
68491-472
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68491-446HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68491-404HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 4 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68491-430HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68491-454HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 54 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10132449-1421GBTLF
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Description |
Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 14 Positions, GW Compatible PA9T, With Shorter Tail Length & Peg, Tape and Reel.
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10159549-140KALF
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Description |
WireLock®, 1.80mm Pitch, WTB connector, USCAR-2 V2 compatible, Receptacle Housing 40pin A Coding
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10132449-1411GLF
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Description |
Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing.
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Official Product Page
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![0449141202 44914-1202](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
0449141202 44914-1202
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Description |
3.00mm (.118) Pitch Micro-Fit 3.0 CPI?/a> Header, Dual Row, Vertical, Compliant Pin Interface, 12 Circuits, LCP, Glass-Filled, UL 94V-0, 0.38μm (15μ) Gold (Au) Selective Contact Plating 3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 12 Circuits, LCP, Glass-Filled, UL 94V-0, 0.38μm (15μ) Gold (Au) Selective Contact Plating
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File Size |
169.89K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68491-424HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 24 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68491-448HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com
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Price and Availability
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