Part Number Hot Search : 
SPP10N10 TM12864 SMAJ10CA TML20515 KTC2018 FTXSM12 ZMM55C13 MTA002
Product Description
Full Text Search
  50736-H221 Datasheet PDF File

For 50736-H221 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    ECJ-1VC1H221J C3216X5R1E106M IR3832WMPBF-11

International Rectifier
Part No. ECJ-1VC1H221J C3216X5R1E106M IR3832WMPBF-11
Description HIGHLY EFFICIENT INTEGRATED SYNCHRONOUS BUCK REGULATOR FOR DDR APPLICATIONS

File Size 743.20K  /  32 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. L17H2212135
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 9/9 (Socket/Pin), 0.76m (30 in) Gold, Bright Tin Shell, M3 Removable Front Screwlock, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    C1005C0G1H221J050BA-16

TDK Electronics
Part No. C1005C0G1H221J050BA-16
Description Multilayer Ceramic Chip Capacitors

File Size 123.05K  /  1 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. G87MPSH2212HR
Description MINI POWER Super 4.2MM
Tech specs    

Official Product Page

    C1005C0G1H221F050BA-17

TDK Electronics
Part No. C1005C0G1H221F050BA-17
Description Multilayer Ceramic Chip Capacitors

File Size 176.92K  /  3 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. L17H2212137
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (.750in), 9/9 (Socket/Pin), 0.76um (30u\\) Gold, Bright Tin Shell, 4-40 Fixed Front Screwlock, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    C1005C0G1H221F050BA-16

TDK Electronics
Part No. C1005C0G1H221F050BA-16
Description Multilayer Ceramic Chip Capacitors

File Size 123.06K  /  1 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. L17H2210124
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (.750in), 9/9 (Socket/Pin), Flash Gold, Bright Tin Shell, M3 Threaded Rear Insert, 2*Arrowhead Boardlock
Tech specs    

Official Product Page

    C1005C0G1H221J050BA-17

TDK Electronics
Part No. C1005C0G1H221J050BA-17
Description Multilayer Ceramic Chip Capacitors

File Size 177.27K  /  3 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. L17H2212237
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 9/9 (Socket/Pin), 0.76m (30 in) Gold, Nickel Shell, 4-40 Fixed Front Screwlock, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    C1005C0G1H221G050BA-16

TDK Electronics
Part No. C1005C0G1H221G050BA-16
Description Multilayer Ceramic Chip Capacitors

File Size 123.05K  /  1 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. L17H2210130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (.750in), 9/9 (Socket/Pin), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    C1005C0G1H221G050BA-17

TDK Electronics
Part No. C1005C0G1H221G050BA-17
Description Multilayer Ceramic Chip Capacitors

File Size 176.92K  /  3 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. L17H2212120
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 9/9 (Socket/Pin), 0.76m (30 in) Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 2*Arrowhead Boardlock
Tech specs    

Official Product Page

    C1608C0G1H221F080AA-16

TDK Electronics
Part No. C1608C0G1H221F080AA-16
Description Multilayer Ceramic Chip Capacitors

File Size 122.52K  /  1 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. L17H2212131
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 9/9 (Socket/Pin), 0.76m (30 in) Gold, Bright Tin Shell, 4-40 Removable Front Screwlock, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    C1608C0G1H221G080AA-16

TDK Electronics
Part No. C1608C0G1H221G080AA-16
Description Multilayer Ceramic Chip Capacitors

File Size 122.53K  /  1 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. L17H2210120
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 9/9 (Socket/Pin), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 2*Arrowhead Boardlock
Tech specs    

Official Product Page

    C1005NP01H221J050BA

TDK Electronics
Part No. C1005NP01H221J050BA
Description Commercial Grade ( High Temperature Application )

File Size 123.08K  /  1 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. L17H2211131
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 9/9 (Socket/Pin), 0.38m (15 in) Gold, Bright Tin Shell, 4-40 Removable Front Screwlock, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

For 50736-H221 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

▲Up To Search▲

 



Bom2Buy.com




Price and Availability



 
Price & Availability of 50736-H221

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
1.2612159252167