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  75784-0130 Datasheet PDF File

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    Agilent(Hewlett-Packard...
Part No. MR-0130.024
Description EGFR 18-21 MASTR
File Size 738.09K  /  2 Page

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Analog Devices
Part No. 5962-9201301MEA
Description IC, MONO HIGH SPEED SHA
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    Winchester Electronics ...
Part No. 01302
Description TRI-METAL PLATED 10/20 AMP TERMINATION
File Size 47.47K  /  1 Page

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Renesas Electronics Corporation
Part No. RTKA210130DE0020BU
Description RAA210130 Evaluation Board
Tech specs 　 　

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    MULTI CONTACT AG
Part No. 21.0100-9 21.0130-9
Description INTERCONNECTION DEVICE
File Size 28.72K  /  1 Page

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Renesas Electronics Corporation
Part No. RTKA210130DE0010BU
Description RAA210130 Socket Board
Tech specs 　 　

Official Product Page

    MULTI CONTACT AG
Part No. 24.0122 49.0130-200-26
Description INTERCONNECTION DEVICE
File Size 110.58K  /  2 Page

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Renesas Electronics Corporation
Part No. ZL8101-30AEV2Z
Description Adaptive Digital DC/DC PWM Controller with Auto Compensation Evaluation Board
Tech specs 　 　

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    90130-3106

Molex Electronics Ltd.
Part No. 90130-3106
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 6 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 168.71K  /  4 Page

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Renesas Electronics Corporation
Part No. RAA210130GBG#AD0
Description Digital DC/DC PMBus 30A Module
Tech specs 　 　

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    71764-0130

Molex Electronics Ltd.
Part No. 71764-0130
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 30 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
File Size 121.01K  /  5 Page

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Renesas Electronics Corporation
Part No. R7F701305EAFP
Description High-end Automotive Microcomputers for Chassis System
Tech specs 　 　

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    90130-3210

Molex Electronics Ltd.
Part No. 90130-3210
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 10 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
File Size 168.44K  /  4 Page

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Renesas Electronics Corporation
Part No. R7F701304EAFP
Description High-end Automotive Microcomputers for Chassis System
Tech specs 　 　

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    90130-3216

Molex Electronics Ltd.
Part No. 90130-3216
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 16 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions
Part No. 54112-107401300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    90130-3214

Molex Electronics Ltd.
Part No. 90130-3214
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 14 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions
Part No. 10075025-G01-30ULF
Description Minitek®, Wire to Board Connectors, Shrouded Header - Through Mount Pin-in-Paste - Double row - 30 Positions - 2mm (0.079inch) - Vertical
Tech specs 　 　

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    90130-3212

Molex Electronics Ltd.
Part No. 90130-3212
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 12 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions
Part No. 10130787-005224BLF
Description HPCE STD VT Receptacle 52P24S
Tech specs 　 　

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