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  abrasion Datasheet PDF File

For abrasion Found Datasheets File :: 523    Search Time::1.219ms    
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    AT77C105A AT77C105ACB08V AT77C105ACB08V-

ATMEL Corporation
Part No. AT77C105A AT77C105ACB08V AT77C105ACB08V-
OCR Text ...p gun) air discharge Mechanical abrasion Number of cycles without lubricant Multiply by a factor of 20 for correlation with a real finger Chemical Resistance Cleaning agent, acid, grease, alcohol, diluted acetone 4 hours Internal method 200...
Description FingerChip Thermal Fingerprint Sweep Sensor, Hardware Based Navigation and Click Functions, Extended I/O range(1.8-3.3V)

File Size 279.22K  /  39 Page

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    MA4E2099 MA4E2099-1284 MA4E2099-1284T MA4E2099-1284W

Tyco Electronics
Part No. MA4E2099 MA4E2099-1284 MA4E2099-1284T MA4E2099-1284W
OCR Text ...ulk handling should insure that abrasion and mechanical shock are minimized. The rugged construction of these HMIC devices allows the use of standard handling and die attach techniques. It is important to note however that industry standard...
Description High Barrier Silicon Schottky Diodes: Bridge Octoquad

File Size 92.95K  /  3 Page

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    FUJITSU[Fujitsu Media Devices Limited]
Part No. FTP-628Y402 FTP-628MCL701 FTP-628Y302
OCR Text ...under our standard conditions). abrasion resistance: paper traveling distance 50km (print ratio: 25% or less) Operating temperature* Operating environment Operating humidity Storage temperature Storage humidity Detection function Head tempe...
Description BATTERY DRIVER, FTP-608 Series(2inch high speed thermal printer) - Vertical Easy Loading Method

File Size 292.60K  /  6 Page

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    ROHM[Rohm]
Part No. KD3004-DC10A
OCR Text ...have adopted low coefficient of abrasion and conductive protection coat to GL40 series which are possible for high speed and good printing quality. That is KD3004-DC10A which is 24V standard thick film thermal print head with high speed, hi...
Description Thick Film Thermal Printhead (300dpi)

File Size 78.06K  /  5 Page

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    MACOM[Tyco Electronics]
Part No. MA4E2501L-1290W MA4E2501-1290 MA4E2501L-1290 MA4E2501L-1290T
OCR Text ...ulk handling should insure that abrasion and mechanical shock are minimized. Die Bonding Die attach for these devices is made simple through the use of surface mount die attach technology. Mounting pads are conveniently located on the b...
Description SILICON, LOW BARRIER SCHOTTKY, KU BAND, MIXER DIODE
SURMOUNTTM Low Barrier 0201 Footprint Silicon Schottky Diodes

File Size 102.85K  /  3 Page

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    MACOM[Tyco Electronics]
Part No. MA4E2502M MA4E2502 MA4E2502H MA4E2502L
OCR Text ...ulk handling should insure that abrasion and mechanical shock are minimized. Die Bonding Die attach for these devices is made simple through the use of surface mount die attach technology. Mounting pads are conveniently located on the b...
Description SURMOUNTTM Low, Medium and High Barrier Silicon Schottky Diodes

File Size 270.60K  /  4 Page

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    MACOM[Tyco Electronics]
Part No. MA4E2508M MA4E2508 MA4E2508H MA4E2508L
OCR Text ...ulk handling should insure that abrasion and Die attach for these devices is made simple through the use of surface mount die attach technology. Mounting pads are conveniently located on the bottom surface of these devices, and are opposite...
Description SURMOUNTTM Low and Medium & High Barrier Silicon Schottky Diodes: Anti-Parallel Pair

File Size 98.58K  /  4 Page

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    MACOM[Tyco Electronics]
Part No. MA4E2513L-1289W MA4E2513 MA4E2513-1289 MA4E2513L-1289 MA4E2513L-1289T
OCR Text ...ulk handling should insure that abrasion and mechanical shock are minimized. Die Bonding Die attach for these devices is made simple through the use of surface mount die attach technology. Mounting pads are conveniently located on the b...
Description SURMOUNT Low Barrier Tee ?301 Footprint Silicon Schottky Diodes
SURMOUNT Low Barrier Tee “0301” Footprint Silicon Schottky Diodes

File Size 87.11K  /  3 Page

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    MACOM[Tyco Electronics]
Part No. MA4E2514M-1116W MA4E2514 MA4E2514L MA4E2514L-1116 MA4E2514L-1116T MA4E2514L-1116W MA4E2514M MA4E2514M-1116
OCR Text ...ulk handling should insure that abrasion and mechanical shock are minimized. Die Bonding Die attach for these devices is made simple through the use of surface mount die attach technology. Mounting pads are conveniently located on the b...
Description SURMOUNT Low and Medium Barrier Silicon Schottky Diodes: Tee Pair

File Size 100.31K  /  4 Page

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For abrasion Found Datasheets File :: 523    Search Time::1.219ms    
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