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				AD[Analog Devices]
Part No.	DAC10GP DAC10GS DAC10GX DAC10FX DAC10
OCR Text	...eference Operation Figure 8. accommodating Bipolar References CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge wi...
Description	10-Bit High Speed Multiplying D/A Converter Universal Digital Logic Interface
File Size	291.13K / 10 Page	View it Online	Download Datasheet

				Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9F2808U0M- K9F2808U0M-YCB0 K9F2808U0M-YIB0
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	16M x 8 Bit NAND Flash Memory
File Size	344.24K / 26 Page	View it Online	Download Datasheet

				Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9F2808U0 K9F2808U0A K9F2808U0A- K9F2808U0A-YCB0 K9F2808U0A-YIB0
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	16M x 8 Bit NAND Flash Memory
File Size	351.20K / 26 Page	View it Online	Download Datasheet

				Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9F4008W0A K9F4008W0A- K9F4008W0A-TCB0 K9F4008W0A-TIB0 K9F4G08U0M
OCR Text	...connected to memory cell arrays accommodating data transfer between the registers and the cell array during frame read and frame program operations. The memory array is composed of unit NAND structures in which 8 cells are connected seriall...
Description	512M x 8 Bits / 1G x 8 Bits NAND Flash Memory 512K x 8 bit NAND Flash Memory
File Size	316.09K / 24 Page	View it Online	Download Datasheet

				International Rectifier, Corp. IRF[International Rectifier]
Part No.	IRF630N IRF630NL IRF630NS
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications be...
Description	Power MOSFET(Vdss=200V, Rds(on)=0.30ohm, Id=9.3A) 功率MOSFET（减振钢板基本\u003d 200V的电压，的Rds（on）\u003d 0.30ohm，身份证\u003d 9.3A Power MOSFET(Vdss=200V/ Rds(on)=0.30ohm/ Id=9.3A) Power MOSFET(Vdss=200V Rds(on)=0.30ohm Id=9.3A)
File Size	152.79K / 11 Page	View it Online	Download Datasheet

				SAMSUNG[Samsung semiconductor] Samsung Electronics Inc
Part No.	K9F6408U0A-TCB0 K9F6408U0A-TIB0
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	From old datasheet system EEPROM,NAND FLASH,8MX8,CMOS,TSOP,44PIN,PLASTIC 8M x 8 Bit NAND Flash Memory
File Size	344.78K / 26 Page	View it Online	Download Datasheet

				Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9F6408U0B K9F6408U0B-TCB0 K9F6408U0B-TIB0
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	8M x 8 Bit NAND Flash Memory
File Size	412.99K / 27 Page	View it Online	Download Datasheet

				Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9F6408U0M-TCB0 K9F6408U0M-TIB0
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	8M x 8 Bit NAND Flash Memory
File Size	477.87K / 26 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRF520L IRF520NS
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications b...
Description	Power MOSFET(Vdss=100V, Rds(on)=0.20ohm, Id=9.7A)
File Size	181.26K / 10 Page	View it Online	Download Datasheet

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