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  bga-48 Datasheet PDF File

For bga-48 Found Datasheets File :: 3383    Search Time::1.437ms    
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    LP62S1664C LP62S1664CU-55LLI LP62S1664CU-55LLT LP62S1664CU-70LLI LP62S1664CU-70LLT LP62S1664CV-55LLI LP62S1664CV-55LLT L

AMIC Technology Corporation
AMICC[AMIC Technology]
Part No. LP62S1664C LP62S1664CU-55LLI LP62S1664CU-55LLT LP62S1664CU-70LLI LP62S1664CU-70LLT LP62S1664CV-55LLI LP62S1664CV-55LLT LP62S1664CV-70LLI LP62S1664CV-70LLT
OCR Text ...in 44-pin TSOP and 48-ball Mini BGA (6X8) packages. 64K X 16 BIT LOW VOLTAGE CMOS SRAM General Description The LP62S1664C is a low operating current 1,048,576bit static random access memory organized as 65,536 words by 16 bits and oper...
Description 64K X 16 BIT LOW VOLTAGE CMOS SRAM

File Size 147.22K  /  15 Page

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    EPM3512A

Altera Corporation
Part No. EPM3512A
OCR Text ... 158, 174, 200 256-Pin FineLine BGA D9 E8 E9 D8 D4 J6 J11 D13 A8, C9, G9, K8, P9 A3, B10, C2, D14, E14, F6, G10, H8, J9, K7, L11, M3, M14, P...48 49 50 51 52 53 208-Pin PQFP 173 175 176 (1) 177 178 169 170 171 172 163 164 166 167 168 256-Pin F...
Description EPM3512A Dedicated Pin-Outs
EPM3512A Dedicated Pin-Outs

File Size 40.61K  /  12 Page

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    TE28F320S3-100 TE28F320S3-120 TE28F160S3-100 TE28F160S3-120 DT28F320S3-100 DT28F320S3-120 GT28F160S3-100 GT28F160S3-120

INTEL[Intel Corporation]
Part No. TE28F320S3-100 TE28F320S3-120 TE28F160S3-100 TE28F160S3-120 DT28F320S3-100 DT28F320S3-120 GT28F160S3-100 GT28F160S3-120 DT28F160S3-100 DT28F160S3-120 GT28F320S3-100 GT28F320S3-120 DT28F320S3-110 TE28F160S3-130 TE28F160S3-75 DT28F160S3-130 DT28F160S3-75 DT28F320S3-140
OCR Text ...ut Industry-Standard Packaging BGA* package, SSOP, and TSOP (16 Mbit) BGA* package and SSOP (32 Mbit) n n n Cross-Compatible Command...48 6.2.7 Erase, Program, And Lock-Bit Configuration Performance.................49 APPENDIX A: Devic...
Description WORD-WIDE FlashFile MEMORY FAMILY

File Size 1,234.30K  /  52 Page

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    CGY2032BTS

NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
Part No. CGY2032BTS
OCR Text ...s SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not n...48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, ...
Description DECT 500 mW power amplifier(DECT 500 mW 功率放大

File Size 61.06K  /  12 Page

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    CGY2032TS

NXP Semiconductors
Philips Semiconductors
Part No. CGY2032TS
OCR Text ...s SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not n...48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, ...
Description DECT 500 mW power amplifier

File Size 60.20K  /  12 Page

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