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  ic arm9 mpu 217-lfbga Datasheet PDF File

For ic arm9 mpu 217-lfbga Found Datasheets File :: 86+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 |   

    Mitsubishi Electric Corporation
Part No. MH28D72KLG-10 MH28D72KLG-75
Description 9,663,676,416-BIT (134,217,728-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module
9 /663 /676 /416-BIT (134 /217 /728-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module

File Size 346.03K  /  39 Page

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    Mitsubishi Electric Corporation
Part No. MH28S72PJG-6
Description 9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMic RAM

File Size 1,014.47K  /  57 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. MH28S72PJG-7 MH28S72PJG-5 MH28S72PJG-6
Description 9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMic RAM

File Size 950.52K  /  57 Page

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    0533071871 53307-1871

Molex Electronics Ltd.
Part No. 0533071871 53307-1871
Description 0.80mm (.031) Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 4.50 and5.50mm (.177 and .217) Stacking Heights, Lead-free, 18 Circuits
0.80mm (.031") Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 4.50 and5.50mm (.177 and .217") Stacking Heights, Lead-free, 18 Circuits
MOLEX Connector

File Size 361.73K  /  6 Page

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    0533073071 53307-3071

Molex Electronics Ltd.
Part No. 0533073071 53307-3071
Description 0.80mm (.031) Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 4.50 and5.50mm (.177 and .217) Stacking Heights, Lead-free, 30 Circuits
0.80mm (.031") Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 4.50 and5.50mm (.177 and .217") Stacking Heights, Lead-free, 30 Circuits
MOLEX Connector

File Size 361.74K  /  6 Page

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    M6MGD13TW66CWG-P

Renesas Electronics, Corp.
Renesas Electronics Corporation
Part No. M6MGD13TW66CWG-P
Description 134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 67,108,864-BIT (4,194,304-WORD BY 16-BIT) CMOS MOBILE RAM 134217728位(8388608字由16位)的CMOS闪存
134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 67,108,864-BIT (4,194,304-WORD BY 16-BIT) CMOS MOBILE RAM
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)

File Size 119.78K  /  3 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. MH28D72KLG-75 MH28D72KLG-10
Description 9,663,676,416-BIT (134,217,728-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module

File Size 334.70K  /  39 Page

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    53307-1071 0533071071

Molex Electronics Ltd.
Part No. 53307-1071 0533071071
Description 0.80mm (.031) Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 4.50 and 5.50mm (.177 and .217) Stacking Heights, Lead-free, 10 Circuits
0.80mm (.031") Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 4.50 and 5.50mm (.177 and .217") Stacking Heights, Lead-free, 10 Circuits

File Size 361.16K  /  6 Page

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    LBS21701

SIPAT Co,Ltd
Part No. LBS21701
Description 217.5MHz SAW Filter 5MHz Bandwidth

File Size 134.94K  /  3 Page

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    53307-2871 0533072871

Molex Electronics Ltd.
Part No. 53307-2871 0533072871
Description 0.80mm (.031") Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 4.50 and5.50mm (.177 and .217") Stacking Heights, Lead-free, 28 Circuits
0.80mm (.031) Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 4.50 and5.50mm (.177 and .217) Stacking Heights, Lead-free, 28 Circuits

File Size 361.54K  /  6 Page

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For ic arm9 mpu 217-lfbga Found Datasheets File :: 86+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 |   

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