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  TC9304F-011 Datasheet PDF File

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    03-09-1011

Molex Electronics Ltd.
Part No. 03-09-1011
Description 2.36mm Diameter Standard

File Size 30.58K  /  1 Page

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HUA FENG CIRCUIT





    Molex, Inc.
Part No. 08-50-0113
Description Crimp Socket Contact; Wire Size (AWG):30-22; Contact Plating:Tin; Series:2759; Lead Pitch:2.54mm; Reel Quantity:10000; Voltage Rating:250V BRASS, TIN OVER NICKEL FINISH, WIRE TERMINAL

File Size 144.65K  /  2 Page

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    21-0111

Maxim Integrated Products
Part No. 21-0111
Description PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD

File Size 25.47K  /  1 Page

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    21-0110

Dallas Semiconducotr
DALLAS[Dallas Semiconductor]
Part No. 21-0110
Description PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm

File Size 50.78K  /  2 Page

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    22-28-0111

Molex Electronics Ltd.
Part No. 22-28-0111
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 11 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 55.32K  /  5 Page

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    RLC ELECTRONICS INC
Part No. BT-0115-FM
Description 100 MHz - 1500 MHz RF/MICROWAVE MONITOR TEE DC BLOCK, 0.4 dB INSERTION LOSS-MAX

File Size 27.50K  /  1 Page

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    22-28-0110

Molex Electronics Ltd.
Part No. 22-28-0110
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 11 Circuits, Tin (Sn) Plating

File Size 167.49K  /  6 Page

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    Asahi Kasei Microsystem...
Part No. HG-0112
Description    Shipped in packet-tape reel(5,000pcs per reel)

File Size 123.23K  /  3 Page

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    Asahi Kasei Microsystem...
Part No. HG-0115
Description    Shipped in packet-tape reel(5,000pcs per reel)

File Size 123.52K  /  3 Page

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    90-0112

Maxim Integrated Products
Part No. 90-0112
Description PACKAGE LAND PATTERN, 9S14) .150 SOIC 14 LEADS

File Size 23.31K  /  1 Page

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Part: TC9304F-027
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Pack: QFP
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Unit price for :
    50: $1.48
  100: $1.40
1000: $1.33

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