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071973 KPE10 ICL7665 30501 KPE10 C221MD 74000 071973
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  thickness.0027 Datasheet PDF File

For thickness.0027 Found Datasheets File :: 1662    Search Time::1.187ms    
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    MMBT918LT1

Motorola, Inc
Part No. MMBT918LT1
OCR Text ...IMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0...
Description VHF/UHF Transistor

File Size 58.54K  /  4 Page

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    Motorola
Part No. MPC942C
OCR Text ...0.020). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER MAY VARY FROM DEPICTION. MILLIMETERS MIN MAX 7.000 BSC 3.500 BSC 7.000 BSC 3.500 BSC 1.400 1.600 0.300 0.450 1.350 1.450 0.300 0.400 0.800 BSC...
Description Low Voltage 1:18 Clock Distribution Chlp

File Size 85.96K  /  4 Page

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    Motorola
Part No. MPC942P
OCR Text ...0.020). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER MAY VARY FROM DEPICTION. MILLIMETERS MIN MAX 7.000 BSC 3.500 BSC 7.000 BSC 3.500 BSC 1.400 1.600 0.300 0.450 1.350 1.450 0.300 0.400 0.800 BSC...
Description MPC942P Low Voltage 1:18 Clock Distribution Chip
Low Voltage 1:18 Clock Distribution Chlp

File Size 90.53K  /  8 Page

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    MPSA55 MMBTA55 PZTA55

FAIRCHILD[Fairchild Semiconductor]
Part No. MPSA55 MMBTA55 PZTA55
OCR Text ... PO Body Width Body Height Body Thickness Lead-Wire Diameter Pitch of Component Feed Hole Pitch Hole Center to Component Center Lead to Lead Distance Component Alignment F-R Tape Width Hole-Down Tape Width Hole Position Hole-Down Tape Posit...
Description PNP General Purpose Amplifier

File Size 2,023.61K  /  13 Page

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    MRF01-J-178 MRF01J-HRMJ MRF01P-HRMJ MRF01-PR-1 MRF01-PR-178 MRF01-R-1 MRF01-R-178

HIROSE[Hirose Electric]
Hirose Electric USA, INC.
HIROSE ELECTRIC Co., Ltd.
Part No. MRF01-J-178 MRF01J-HRMJ MRF01P-HRMJ MRF01-PR-1 MRF01-PR-178 MRF01-R-1 MRF01-R-178
OCR Text ...pe II Card The 3 mm receptacle thickness permits mounting to the back side of a type II card. Note that at the time of card mounting, use of 0.15mm offset of the board mounting surface from the card center line will result in the same card...
Description    Push-On Coaxial Connectors (PC Card Type 2 Mountable)
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Crimp; Body Material:Metal; Series:MS C-26482 Series I; No. of Contacts:15; Connector Shell Size:14; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No
Push-On Coaxial Connectors (PC Card Type 2 Mountable) 推进式同轴连接器(PC卡类挂墙

File Size 103.33K  /  4 Page

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    OKI ELECTRIC INDUSTRY CO LTD
Part No. MSM548128BL MSM548128BL-70GS-K MSM548128BL-80GS-K
OCR Text ...rial Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 4.70 TYP. 11/12 Semiconductor MSM548128BL (Unit : mm) SOP32-P-525-1.27-K Mirror finish Package material L...
Description 128K X 8 PSEUDO STATIC RAM, 80 ns, PDSO32
128K X 8 PSEUDO STATIC RAM, 70 ns, PDSO32
From old datasheet system
131,072-Word x 8-Bit High-Speed PSRAM

File Size 179.83K  /  12 Page

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    MSM63184A

OKI electronic componets
Part No. MSM63184A
OCR Text ...EG1 SEG0 X Chip Size Chip Thickness Coordinate Origin Pad Hole Size Pad Size Minimum Pad Pitch : : : : : : 5.35 mm 4.66 mm 350 mm (typ.) Chip center 100 mm 100 mm 110 mm 110 mm 140 mm Note: The chip substrate voltage is VS...
Description 4-Bit Microcontroller with Built-in 640-Dot Matrix LCD Drivers, Operating at 0.9 V (Min.)

File Size 258.90K  /  30 Page

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    MSM63184B

OKI electronic componets
Part No. MSM63184B
OCR Text ...EG1 SEG0 X Chip Size Chip Thickness Coordinate Origin Pad Hole Size Pad Size Minimum Pad Pitch : : : : : : 5.35 mm 4.66 mm 350 mm (typ.) Chip center 100 mm 100 mm 110 mm 110 mm 140 mm Note: The chip substrate voltage is VS...
Description 4-Bit Microcontroller with Built-in 640-Dot Matrix LCD Drivers, Operating at 0.9 V (Min.)

File Size 191.40K  /  29 Page

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    NJU6343

New Japan Radio
Part No. NJU6343
OCR Text ...] Chip Size:1.1x0.9mm Thin-Chip Thickness(-D):20020um Pad Size:90x90um Note1) Substrate: VDD level sBLOCK DIAGRAM XT XT Rf VDD VSS Vc Cg Cgv Cd Cdv 3-STATE BUFFER FOUT CONT 2004/01/15 ( 1 / 5 ) NJU6343 sTE...
Description 50MHz VCXO IC

File Size 71.29K  /  5 Page

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