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  39 cm 15 4 inches 1280 x 1024 Datasheet PDF File

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    EMCORE CORP
Part No. 3000TD-NNSP 3000TC-NNSP 3000TH-NNSP 3000TB-NNSP 3000TF-NNSP 3000TG-NNSP 3000RB-SFAP
Description FIBER OPTIC TRANSMITTER, 1280-1340nm, PANEL MOUNT, SC/APC CONNECTOR
FIBER OPTIC RECEIVER, 1280-1340nm, PANEL MOUNT, FC/APC CONNECTOR

File Size 285.07K  /  2 Page

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    Optek Technology
Part No. KT872N15 KT872N55 KT872P51 KT872P55 KT872T55 KT872P15 KT872T15 KT872T51 KT860N11 KT860N51 KT860T51 KT861N51 KT861N55 KT861P51 KT862L15 KT860N15 KT860P15 KT861T55 KT860L11 KT860P51 KT861T51 KT861N15 KT861P15 KT875P55 KT865P55 KT876T15 KT876N51 KT876N55 KT871N51 KT871N15 KT867T15 KT867T51 KT867T55
Description Slotted optical switch phototransistor output. Opaque polysulpone discrete shells with .02 inches SQ, leads. Electrical parameter C lead spacing .320 inches. Aperture in front of sensor .010 inches. Aperture in front of emitter .050 inches
Slotted optical switch phototransistor output. Opaque polysulpone discrete shells with .02 inches SQ, leads. Electrical parameter C lead spacing .320 inches. Aperture in front of sensor .050 inches. Aperture in front of emitter .050 inches
Slotted optical switch phototransistor output. Opaque polysulpone discrete shells with .02 inches SQ, leads. Electrical parameter C lead spacing .320 inches. Aperture in front of sensor .050 inches. Aperture in front of emitter .010 inches
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches. Electrical parameter A lead spacing .320 inches. Aperture width in front of sensor .010 inches. Aperture width in front of emitter .
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter A lead spacing .320inches. Aperture in front of sensor .050inches. Aperture width in front of emitter
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter B lead spacing .320 inches. Aperture in front of sensor .050 inches. Aperture in front of emitter .01
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter B lead spacing .320 inches. Aperture in front of sensor .050 inches. Aperture in front of emitter .05
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter C lead spacing .320 inches. Aperture in front of sensor .010 inches. Aperture in front of emitter .05
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter B lead spacing .320inches. Aperture in front of sensor .050inches. Aperture in front of emitter .050i
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter A lead spacing .320inches. Aperture width in front of sensor .050inches. Aperture in front of emitter
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter B lead spacing .320 inches. Aperture in front of sensor .010 inches. Aperture in front of emitter .0
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter B lead spacing .320 inches. Aperture in front of sensor .010 inches. Aperture in front of emitter .05
Slotted optical switch phototransistor output. Opaque polysulpone discrete shells with .02 inches SQ, leads. Electrical parameter A lead spacing .220 inches. Aperture in front of sensor .050 inches. Aperture in front of emitter .050 inches
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter A lead spacing .220 inches. Aperture in front of sensor .050 inches. Aperture in front of emitter .05
Slotted optical switch phototransistor output. Opaque polysulpone discrete shells with .02 inches SQ, leads. Electrical parameter B lead spacing .220 inches. Aperture in front of sensor .010 inches. Aperture in front of emitter .050 inches
Slotted optical switch phototransistor output. Opaque polysulpone discrete shells with .02 inches SQ, leads. Electrical parameter B lead spacing .220 inches. Aperture in front of sensor .050 inches. Aperture in front of emitter .010 inches
Slotted optical switch phototransistor output. Opaque polysulpone discrete shells with .02 inches SQ, leads. Electrical parameter B lead spacing .220 inches. Aperture in front of sensor .050 inches. Aperture in front of emitter .050 inches
Slotted optical switch phototransistor output. Opaque polysulpone discrete shells with .02 inches SQ, leads. Electrical parameter B lead spacing .320 inches. Aperture in front of sensor .050 inches. Aperture in front of emitter .010 inches
Slotted optical switch phototransistor output. Opaque polysulpone discrete shells with .02 inches SQ, leads. Electrical parameter B lead spacing .320 inches. Aperture in front of sensor .010 inches. Aperture in front of emitter .050 inches
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter C lead spacing .220 inches. Aperture in front of sensor .010 inches. Aperture in front of emitter .05
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter C lead spacing .220 inches. Aperture in front of sensor .050 inches. Aperture in front of emitter .01
Slotted optical switch phototransistor output. IR transmissive polysulpone discrete shells with .02inches SQ, leads. Electrical parameter C lead spacing .220 inches. Aperture in front of sensor .050 inches. Aperture in front of emitter .05

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    Toshiba Corporation
Part No. TMP90PM38
Description A System Evaluation LSI With 8-Bit CPU,One-Time PROM(32968 x 8-Bit),RAM(1024 x 8-Bit)(系统评估大规模集成电路(集成8位CPU,一次可编程ROM(32968 x 8,RAM(1024 x 8)

File Size 884.73K  /  22 Page

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    Toshiba Corporation
Part No. TMP90PM36
Description A System Evaluation LSI With 8-Bit CPU,One-Time PROM(32968 x 8-Bit),RAM(1024 x 8-Bit)(系统评估大规模集成电路(集成8位CPU,一次可编程ROM(32968 x 8,RAM(1024 x 8)

File Size 954.27K  /  22 Page

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    xilinx, Inc.
xILINx INC
Part No. xC4028Ex-2HQ240C xC4028Ex-2HQ304C xC4028Ex-2HQ208C xC4036Ex-4HQ240C xC4028Ex-3PG299C xC4025E-1HQ304C
Description FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP240 HEAT SINK, QFP-240
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP304 HEAT SINK, QFP-304
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP208 HEAT SINK, QFP-208
FPGA, 1296 CLBS, 22000 GATES, 143 MHz, PQFP240
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, CPGA299
FPGA, 1024 CLBS, 15000 GATES, 166 MHz, PQFP304

File Size 914.77K  /  124 Page

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    ISL6700IBZ ISL6700IR ISL6700IRZ ISL6700IB ISL6700

INTERSIL[Intersil Corporation]
Part No. ISL6700IBZ ISL6700IR ISL6700IRZ ISL6700IB ISL6700
Description 1024 x 9 x 2 Asynchronous Bidirectional FIFO Memory 44-PLCC 0 to 70
1024 x 9 x 2 Asynchronous Bidirectional FIFO Memory 64-TQFP 0 to 70
80V/1.25A Peak, Medium Frequency, Low Cost, Half-Bridge Driver

File Size 249.47K  /  8 Page

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    M62362FP M62362P

Renesas Electronics Corporation
Part No. M62362FP M62362P
Description 1280 Resolution 3ch Multiplying D/A Converter

File Size 107.12K  /  11 Page

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    TA0726A

TAI-SAW TECHNOLOGY CO., LTD.
Part No. TA0726A
Description SAW Filter 1280.18 MHz SMD 3.0x3.0 mm

File Size 248.77K  /  8 Page

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    880368

TriQuint Semiconductor
Part No. 880368
Description 1280 MHz L-Band BAW Filter

File Size 270.74K  /  6 Page

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    MAxIM[Maxim Integrated Products]
Part No. DS2704W DS2704 DS2704G_ DS2704G_TR DS2704GTR DS2704G
Description 1280-Bit EEPROM with SHA-1 Authentication

File Size 222.42K  /  18 Page

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