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  43045-0819 Datasheet PDF File

For 43045-0819 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43045-0614

Molex Electronics Ltd.
Part No. 43045-0614
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 6 Circuits

File Size 166.54K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43045-2412

Molex Electronics Ltd.
Part No. 43045-2412
Description
File Size 166.52K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs    

Official Product Page

    43045-1221

Molex Electronics Ltd.
Part No. 43045-1221
Description
File Size 183.78K  /  3 Page

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Renesas Electronics Corporation

Part No. RJK0819DSP-00#J0
Description Nch Dual Power Mosfet 80V 2.4A 175Mohm Sop8
Tech specs    

Official Product Page

    43045-1209

Molex Electronics Ltd.
Part No. 43045-1209
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 12 Circuits

File Size 176.77K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-809081900LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 8 Positions
Tech specs    

Official Product Page

    43045-1813

Molex Electronics Ltd.
Part No. 43045-1813
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits

File Size 166.55K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-811081900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-1818

Molex Electronics Ltd.
Part No. 43045-1818
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits

File Size 175.78K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-112081950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    43045-0221

Molex Electronics Ltd.
Part No. 43045-0221
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip

File Size 183.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-F08-19LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 38 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    43045-1812

Molex Electronics Ltd.
Part No. 43045-1812
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits

File Size 166.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-S08-19LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions
Tech specs    

Official Product Page

    43045-1810

Molex Electronics Ltd.
Part No. 43045-1810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits

File Size 180.51K  /  3 Page

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    43045-2411

Molex Electronics Ltd.
Part No. 43045-2411
Description
File Size 180.51K  /  3 Page

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