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  chips. Datasheet PDF File

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    PM50CLB120

Mitsubishi Electric Semiconductor
Part No. PM50CLB120
OCR Text ...urement point is just under the chips (Bottom view). If you use this value, Rth(f-a) should be measured just under the chips. (Note-2) TC measurement point is as shown below (Top view). Table1 : TC measurement point of just under the chips....
Description FLAT-BASE TYPE INSULATED PACKAGE
File Size 93.04K  /  6 Page

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    PM300CBS060

Mitsubishi Electric Semiconductor
Part No. PM300CBS060
OCR Text ...ion by detecting Tj of the IGBT chips * 3 300A, 600V Current-sense IGBT type inverter * Monolithic gate drive & protection logic * Detection, protection & status indication circuits for overcurrent, short-circuit, over-temperature & under-v...
Description INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE
File Size 115.97K  /  6 Page

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    SMP1353-099 SMP1322-099 SMP1340-099

Skyworks Solutions Inc.
Part No. SMP1353-099 SMP1322-099 SMP1340-099
OCR Text Chips Supplied on Film Frame Features Designed for high-performance switch and attenuator applications Preferred device for module applications PIN diodes supplied 100% tested, sawn, mounted on film frame Low cost Available lead (Pb...
Description PIN Diode Chips Supplied on Film Frame
File Size 184.38K  /  5 Page

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    1403

Vishay Siliconix
Part No. 1403
OCR Text ... contain up to 5, V5X5 resistor chips. Note that case grounding limits the circuit options to a two resistor divider. Review data sheet "7 Technical Reasons to Specify Bulk Metal(R) Foil Resistor Networks." Product may not be to scale O...
Description Bulk Metal Foil Technology 4 Pin Transistor Outline Hermetic Resistor Network
File Size 49.36K  /  1 Page

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    CM150RX-24S

Powerex Power Semiconductors
Powerex Power Semiconductor...
Part No. CM150RX-24S
OCR Text ...he heatsink side just under the chips. refer to the figure to the right for chip location. the heatsink thermal resistance should be measured just under the chips. 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 3...
Description Six IGBT Brake NX-Series Module 150 Amperes/1200 Volts
File Size 1,479.67K  /  13 Page

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    AD708 AD708AH AD708AQ AD708BH AD708BQ AD708JGRADECHIPS AD708JN AD708SGRADECHIPS AD708SH AD708SQ AD708SH_883B

AD[Analog Devices]
Part No. AD708 AD708AH AD708AQ AD708BH AD708BQ AD708JGRADECHIPS AD708JN AD708SGRADECHIPS AD708SH AD708SQ AD708SH_883B
OCR Text ...p and TO-99 Metal Can Packages, Chips and /883B Parts Available. Ultralow Offset Voltage Dual Op Amp AD708 CONNECTION DIAGRAMS TO-99 (H) Package Plastic (N ), and Cerdip (Q) Packages PRODUCT DESCRIPTION The AD708 is a very high...
Description    Ultralow Offset Voltage Dual Op Amp
File Size 409.00K  /  8 Page

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    PCR PCR0805 PCR08051M0B PCR08051M0C PCR08051M0D PCR1005 PCR10051M0B PCR10051M0C PCR10051M0D PCR1206 PCR12061M0B PCR12061

Welwyn Components Limited
Part No. PCR PCR0805 PCR08051M0B PCR08051M0C PCR08051M0D PCR1005 PCR10051M0B PCR10051M0C PCR10051M0D PCR1206 PCR12061M0B PCR12061M0C PCR12061M0D
OCR Text ...perating Temperature Range The chips can operate at a maximum temperature of 155C (see Performance Data). For soldered chips, the joint temperature should not exceed 110C. This condition is met when the stated power levels at 70C are used....
Description Precision Thick Film Surface Mounted Resistors
File Size 94.23K  /  2 Page

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    RA13H8891MA RA13H8891MA-101

Mitsubishi Electric Semiconductor
Part No. RA13H8891MA RA13H8891MA-101
OCR Text ...silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated with resin. Lines on the substrate (eventually inductors), chip capacitors, and resistors form the bias and matching circuits. Wire le...
Description 889-915MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO
File Size 92.59K  /  8 Page

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    AMPAD708 AD708AH AD708AQ AD708BH AD708BQ AD708JGRADECHIPS AD708JN AD708SGRADECHIPS AD708SH AD708SH_883B AD708SQ

AD[Analog Devices]
Part No. AMPAD708 AD708AH AD708AQ AD708BH AD708BQ AD708JGRADECHIPS AD708JN AD708SGRADECHIPS AD708SH AD708SH_883B AD708SQ
OCR Text ...p and TO-99 Metal Can Packages, Chips and /883B Parts Available. Ultralow Offset Voltage Dual Op Amp AD708 CONNECTION DIAGRAMS TO-99 (H) Package Plastic (N ), and Cerdip (Q) Packages PRODUCT DESCRIPTION The AD708 is a very high...
Description Ultralow Offset Voltage Dual Op Amp
File Size 402.14K  /  8 Page

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Part No. HD40A4054H
OCR Text ...nd discrete devices, and memory chips other than drams (flash memory, srams etc.) accordingly, although hitachi, hitachi, ltd., hitachi semiconductors, and other hitachi brand names are mentioned in the document, these names have in fact ...
Description MROM, MICROCONTROLLER, PQFP44
File Size 428.21K  /  105 Page

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Price and Availability
 
Price & Availability of chips.
Newark

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OVAL-24SW-CHIP-SMA
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3731 TAN CHIPS 22 LB
80AK4459		 3M Interconnect Hot Melt Adhesive 3731 Tan Chips 22 Lb/Case 7100031985 |3M 3731 TAN CHIPS 22 LB 250: USD34.11
100: USD35.3
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Analog Devices Inc

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Onlinecomponents.com

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AD7714ACHIPS-5
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AD847SCHIPS
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