Part Number Hot Search : 
32M16 1E104 4016B B1962 BCR16 200MHZ M82C43 HCC242TX
Product Description
Full Text Search
  GDM-8246 Datasheet PDF File

For GDM-8246 Found Datasheets File :: 105+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 |   

    DIM400GDM33-A000

Dynex Semiconductor Ltd.
Part No. DIM400GDM33-A000
Description Dual Switch IGBT Module Preliminary Information

File Size 162.21K  /  10 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 77313-824-68LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 68 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    B82464-A4474-K B82464-A4222-M B82464-A4334-K B82464-A4362-M B82464-A4153-K B82464-A4102-M B82464-A4333-K B82464-A4473-K

EPCOS
Part No. B82464-A4474-K B82464-A4222-M B82464-A4334-K B82464-A4362-M B82464-A4153-K B82464-A4102-M B82464-A4333-K B82464-A4473-K B82464-A4154-K
Description SMT?Power?Inductors

File Size 41.25K  /  3 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 77313-824-66LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions
Tech specs    

Official Product Page

    B82462A4333K

TDK Electronics
Part No. B82462A4333K
Description SMT power inductors

File Size 543.15K  /  9 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 48246-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs    

Official Product Page

    DIM500GDM33-TS000 DIM500GDM33-TS000-15

Dynex Semiconductor
Part No. DIM500GDM33-TS000 DIM500GDM33-TS000-15
Description Dual Switch IGBT Module

File Size 359.47K  /  8 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 68482-460HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    DIM500GDM33-TL000 DIM500GDM33-TL000-15

Dynex Semiconductor
Part No. DIM500GDM33-TL000 DIM500GDM33-TL000-15
Description Dual Switch IGBT Module

File Size 358.45K  /  8 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. RJE451882461
Description Modular Jack - High Performance, Input Output Connectors 8P8C, Vertical, CAT6, Shield, With LEDs.
Tech specs    

Official Product Page

    VI-982438 VI-982460 VI-982461 VI-982462 VI-982463 VI-982464 VI-982465 VI-982466 VI-982467 VI-982468 VI-982469 VI-982437

Vicor Corporation
Part No. VI-982438 VI-982460 VI-982461 VI-982462 VI-982463 VI-982464 VI-982465 VI-982466 VI-982467 VI-982468 VI-982469 VI-982437
Description 24Vin / 48Vout / 400Watts DC-DC Converter Module

File Size 190.55K  /  9 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. RJE451882461T
Description Modular Jack - 8P8C, Vertical, Cat6, THR, No Panel Stops, Single Port, Shield With No Tabs, With LEDs
Tech specs    

Official Product Page

    Hynix
Part No. HY27UG088GDM
Description 8Gb NAND Flash

File Size 426.99K  /  50 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 77313-824-64LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 64 Positions
Tech specs    

Official Product Page

    Hynix Semiconductor, Inc.
Part No. HY27UG084GDM-TPEB
Description 512M X 8 FLASH 3.3V PROM, 30 ns, PDSO48 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48

File Size 446.78K  /  53 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 68482-468HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Hynix Semiconductor, Inc.
Part No. HY27UH088GDM-TPEB HY27UH088GDM-TIS HY27UH088GDM-TIP
Description 1G X 8 FLASH 3.3V PROM, 30 ns, PDSO48 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48
1G X 8 FLASH 3.3V PROM, 30 ns, PDSO48 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48

File Size 440.94K  /  53 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 67998-246HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail
Tech specs    

Official Product Page

    B82464-G4332-M B82464-G4474-M B82464-G4821-M 317108 B82464-G4472-M B82464-G4224-M B82464-G4334-M B82464-G4682-M B82464-G

EPCOS
Part No. B82464-G4332-M B82464-G4474-M B82464-G4821-M 317108 B82464-G4472-M B82464-G4224-M B82464-G4334-M B82464-G4682-M B82464-G4102-M B82464-G4105-M B82464-G4223-M B82464-G4333-M B82464-G4103-M
Description SMT-Power-Inductors

File Size 41.07K  /  3 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. RJE4A1882461
Description Modular Jacks, Input Output Connectors 8P8C, Vertical, CAT6A, Shield, With LEDs
Tech specs    

Official Product Page

For GDM-8246 Found Datasheets File :: 105+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 |   

▲Up To Search▲

 



Bom2Buy.com




Price and Availability



 
Price & Availability of GDM-8246

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
1.3175458908081