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EPCOS[EPCOS]
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| Part No. |
B59062A0160A010 B59062 B59062A0120A010 B59062A0140A010
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| OCR Text |
heating Elements Metallized Round Disks, 42 V Power Net
Applications
I Automotive applications
B59062 A 62
- diesel fuel preheating - defrosting (e. g. spray nozzle heating) Features
I Silver metallization I Suitable for clamp cont... |
| Description |
Metallized Round Disks, 42 V Power Net heating Elements
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| File Size |
75.06K /
3 Page |
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it Online |
Download Datasheet
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ONSEMI[ON Semiconductor]
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| Part No. |
BCP68T1
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| OCR Text |
...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C.
* The soldering temperature and time should not exceed * When shifting from preheating to soldering, the * After solderi... |
| Description |
MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT
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| File Size |
108.14K /
6 Page |
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it Online |
Download Datasheet |
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Motorola, Inc.
MOTOROLA[Motorola, Inc]
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| Part No. |
BSP16T1
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| OCR Text |
...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C.
* The soldering temperature and time should not exceed * When shifting from preheating to soldering, the * After solderi... |
| Description |
SOT-223 PACKAGE PNP SILICON HIGH VOLTAGE TRANSISTOR SURFACE MOUNT
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| File Size |
109.07K /
6 Page |
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it Online |
Download Datasheet |
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Motorola, Inc.
MOTOROLA[Motorola, Inc]
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| Part No. |
BSP62T1
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| OCR Text |
...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C.
* The soldering temperature and time should not exceed * When shifting from preheating to soldering, the * After solderi... |
| Description |
MEDIUM POWER PNP SILICON DARLINGTON TRANSISTOR SURFACE MOUNT
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| File Size |
178.97K /
6 Page |
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it Online |
Download Datasheet |
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SEOUL[Seoul Semiconductor]
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| Part No. |
BW104-S
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| OCR Text |
...le (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max.
LED Surface temperature
C Operation heating 240
150
~
Pre-heating
Temperature rise: 5C/sec.
Coo... |
| Description |
CHIP LED DEVICE
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| File Size |
351.55K /
10 Page |
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it Online |
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BOURNS[Bourns Electronic Solutions]
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| Part No. |
CG0603MLD-12E CG0402MLD-12G
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| OCR Text |
...3 Preheat Preheat to 200 C Main heating 200 210 220 230 240 C C C C C 60 s to 120 s 20 s to 40 s 60 55 50 40 30 s s s s s to to to to to 70 65 60 50 40 s s s s s
Temperature (C)
E
Cooling
200 C to 100 C
1 C/s to 4 C/s
* * ... |
| Description |
Chip Guard? MLD Series Varistor ESD Clamp Protectors
Chip Guard㈢ MLD Series Varistor ESD Clamp Protectors
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| File Size |
140.82K /
3 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
CGAT
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| OCR Text |
....0 39.0 d (max) Recovered after heating mm 1.0 2.0 3.0 4.0 6.0 8.0 13.0
Wall thickness W (nom) Recovered after heating Black Clear mm 1.00 1.00 1.35 1.50 1.70 1.95 2.10 mm 1.00 1.00 1.40 1.78 2.25 2.54 2.54 W1 (nom) Meltable wall recover... |
| Description |
Adhesive lined polyolefin heat-shrinkable tubing
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| File Size |
26.98K /
2 Page |
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it Online |
Download Datasheet |
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Price and Availability
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