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moulding Datasheet PDF File

For moulding Found Datasheets File :: 308 Search Time::4.094ms
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				International Rectifier
Part No.	IRLI3215PBF
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	150V Single N-Channel HEXFET Power MOSFET in a Lead Free TO-220FullPAK package Advanced Process Technology
File Size	210.72K / 8 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRLI530NPBF
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	HEXFET Power MOSFET
File Size	222.58K / 8 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRFIZ44NPBF
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	HEXFET Power MOSFET
File Size	259.59K / 8 Page	View it Online	Download Datasheet

For moulding Found Datasheets File :: 308 Search Time::4.094ms
Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |