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  silver silver Datasheet PDF File

For silver silver Found Datasheets File :: 9132    Search Time::1ms    
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    MAX2104CCM

MAXIM[Maxim Integrated Products]
Part No. MAX2104CCM
OCR Text ...8-Lead TQFP Copper Solder Plate silver-filled Epoxy Gold (1.02mil dia.) Epoxy with silica filler Buildsheet # 05-7001-0319 Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Informa...
Description PLASTIC ENCAPSULATED DEVICES

File Size 90.36K  /  7 Page

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    DA121TT1 DA121TT1/D

ON Semiconductor
Part No. DA121TT1 DA121TT1/D
OCR Text ...older used was 62/36/2 Tin Lead silver with a melting point between 177-189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by ...
Description Silicon Switching Diode

File Size 124.23K  /  8 Page

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    DTA143EE DTA143EE_D ON0279

ON Semiconductor
MOTOROLA[Motorola, Inc]
Part No. DTA143EE DTA143EE_D ON0279
OCR Text ...older used was 62/36/2 Tin Lead silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by...
Description Bias Resistor Transistor
CASE 463-01, STYLE 1 SOT-416/SC-90
CASE 463-1, STYLE 1 SOT-16/SC-0
From old datasheet system

File Size 93.71K  /  4 Page

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    BSP19AT1 BSP20AT1

Motorola Inc
MOTOROLA[Motorola, Inc]
Part No. BSP19AT1 BSP20AT1
OCR Text ...older used was 62/36/2 Tin Lead silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by...
Description SOT.223 PACKAGE NPN SILICON HIGH VOLTAGE TRANSISTOR SURFACE MOUNT

File Size 119.13K  /  6 Page

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    MAX1567ETL

MAXIM[Maxim Integrated Products]
Part No. MAX1567ETL
OCR Text ...QFN (6 x 6) Copper Solder Plate silver-Filled Epoxy Gold (1.3 mil dia.) Epoxy with silica filler # 05-9000-0520 Class UL94-V0 Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Mi...
Description PLASTIC ENCAPSULATED DEVICES

File Size 126.18K  /  8 Page

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    MAX8585EUA MAX8535EUA MAX8536EUA MAX8535 MAX8535AEUA

MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
Part No. MAX8585EUA MAX8535EUA MAX8536EUA MAX8535 MAX8535AEUA
OCR Text ...X8535) +VO -VO Applications silver Box Supplies for Servers On-Board Redundant Power Supplies in Blade Servers Network/Telecom Power Supplies Rectifiers Redundant Power Supplies in High-Availability Systems silver BOX OR RECTIFIERS VCC...
Description ORing MOSFET Controllers with Fastest Fault Isolation for Redundant Power Supplies

File Size 295.08K  /  20 Page

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    MMBD2005T1 MMBD3005T1 MMBD1005LT1

MOTOROLA[Motorola, Inc]
Part No. MMBD2005T1 MMBD3005T1 MMBD1005LT1
OCR Text ...older used was 62/36/2 Tin Lead silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by...
Description Switching Diode

File Size 159.99K  /  8 Page

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    MMFT2406T1 MMFT2406T MMFT2406T1_D ON2217

Motorola Mobility Holdings, Inc.
ON Semi
MOTOROLA[Motorola, Inc]
Part No. MMFT2406T1 MMFT2406T MMFT2406T1_D ON2217
OCR Text ...older used was 62/36/2 Tin Lead silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by...
Description MEDIUM POWER TMOS FET 700 mA 240 VOLTS 0.7 A, 240 V, 6 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-261AA
N-hannel Enhancement-ode Logic Level SOT23
From old datasheet system

File Size 87.87K  /  6 Page

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    MSD42WT1 ON2379

MOTOROLA[Motorola, Inc]
Part No. MSD42WT1 ON2379
OCR Text ...older used was 62/36/2 Tin Lead silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by...
Description From old datasheet system
NPN GENERAL PURPOSE HIGH VOLTAGE TRANSISTORS SURFACE MOUNT

File Size 74.51K  /  4 Page

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For silver silver Found Datasheets File :: 9132    Search Time::1ms    
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