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AOP800L SB830 F1001 2SB1392 83C1R 3412J B1290 STM32F
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    AN10365

NXP Semiconductors
Part No. AN10365
OCR Text ...green is solder resist. the cu underneath the solder resist is shown in a lighter shade of green. the alternative situation is that the solder resist layer starts outside of the cu. in that case, the solder lands are cu defined. this i...
Description Surface mount reflow soldering

File Size 522.29K  /  31 Page

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    1P520

Anaren Microwave
Part No. 1P520
OCR Text ...ne with 100% solder connection underneath the part. if either of these two conditions is not satisfied, insertion loss, coupling, vswr and directivity may not meet published specifications. suggested footprint 1p520* mounting foo...
Description Pico Xinger 20dB Directional Coupler

File Size 142.23K  /  4 Page

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    1P510

Anaren Microwave
Part No. 1P510
OCR Text ...ne with 100% solder connection underneath the part. if either of these two conditions is not satisfied, insertion loss, coupling, vswr and directivity may not meet published specifications. suggested footprint 1p510* mounting fo...
Description PICO XINGER 10dB DIRECTIONAL COUPLER

File Size 142.63K  /  4 Page

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    Gennum Corporation
Part No. EB9024
OCR Text ...inuous ground plane is provided underneath all high speed traces avoiding impedance discontinuities and en- suring maximum signal integrity - copper on the power and ground planes has been re- moved from the area surrounding the center pin ...
Description GENLINX-TM II EB9024 Evaluation Board

File Size 116.54K  /  9 Page

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    TriQuint Semiconductor, Inc.
Part No. AP502
OCR Text ... 2. the area around the module underneath the pcb should not contain any soldermask in order to maintain good rf grounding. 3. for proper and safe operation in the laboratory, the power-on sequencing should be followed: a. connect rf...
Description
File Size 849.49K  /  5 Page

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