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  001456-8081 Datasheet PDF File

For 001456-8081 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0014564093

Molex Electronics Ltd.
Part No. 0014564093
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version D, Back Ribs, Wire Size 26, 0.76μm (30μ) Gold (Au), 9 Circuits

File Size 156.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-408081150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    14-56-4044 0014564044

Molex Electronics Ltd.
Part No. 14-56-4044 0014564044
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 28, 0.76μm (30μ) Gold (Au), 4 Circuits
2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 28, 0.76楼矛m (30楼矛") Gold (Au), 4 Circu

File Size 157.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131318-08111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 8 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    0014562175

Molex Electronics Ltd.
Part No. 0014562175
Description MOLEX Connector

File Size 152.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-108081200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0014567174

Molex Electronics Ltd.
Part No. 0014567174
Description
File Size 148.42K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-808101500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0014564092

Molex Electronics Ltd.
Part No. 0014564092
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 26, 0.76μm (30μ) Gold (Au), 9 Circuits

File Size 159.40K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-108081650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-56-3025 0014563025

Molex Electronics Ltd.
Part No. 14-56-3025 0014563025
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 24, 0.38μm (15μ) Gold (Au), 2 Circuits

File Size 161.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-808181000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-56-4062 0014564062

Molex Electronics Ltd.
Part No. 14-56-4062 0014564062
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 26, 0.76μm (30μ) Gold (Au), 6 Circuits
2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 26, 0.76楼矛m (30楼矛") Gold (Au), 6 Circ

File Size 159.70K  /  3 Page

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Amphenol Communications Solutions

Part No. 83808-10010
Description Shield (Type I) closed end, with shield insulator
Tech specs    

Official Product Page

    0014564091

Molex Electronics Ltd.
Part No. 0014564091
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 0.76μm (30μ) Gold (Au), 9 Circuits

File Size 153.71K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-108081300LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0014563182

Molex Electronics Ltd.
Part No. 0014563182
Description
File Size 147.91K  /  3 Page

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Amphenol Communications Solutions

Part No. 59112-S38-08-124LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions.
Tech specs    

Official Product Page

    0014563095

Molex Electronics Ltd.
Part No. 0014563095
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 24, 0.38μm (15μ) Gold (Au), 9 Circuits

File Size 161.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 10142708-08100LF
Description Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 8 Positions, 15u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, With Pegs, Tray.
Tech specs    

Official Product Page

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