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  87759-4475 Datasheet PDF File

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    87759-1875

Molex Electronics Ltd.
Part No. 87759-1875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap
File Size 280.29K  /  6 Page

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Amphenol Communications Solutions
Part No. 447-5025-063
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 25 positions, open, 4.25mm (0.167in), Header.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    87759-1450

Molex Electronics Ltd.
Part No. 87759-1450
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 174.22K  /  4 Page

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Amphenol Communications Solutions
Part No. 447-5010-063
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 10 positions, open, 4.25mm (0.167in), Header.
Tech specs 　 　

Official Product Page

    87759-1814

Molex Electronics Ltd.
Part No. 87759-1814
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 420.10K  /  8 Page

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Amphenol Communications Solutions
Part No. 447-5025-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 25 positions, open, 4.75mm (0.187in), Header.
Tech specs 　 　

Official Product Page

    87759-1475

Molex Electronics Ltd.
Part No. 87759-1475
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 280.41K  /  6 Page

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Amphenol Communications Solutions
Part No. 447-5010-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 10 positions, open, 4.75mm (0.187in), Header.
Tech specs 　 　

Official Product Page

    87759-1476

Molex Electronics Ltd.
Part No. 87759-1476
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.83K  /  6 Page

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Amphenol Communications Solutions
Part No. 447-5025-062
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 25 positions, open, 6.25mm (0.246in), Header.
Tech specs 　 　

Official Product Page

    87759-1474

Molex Electronics Ltd.
Part No. 87759-1474
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap
File Size 421.28K  /  8 Page

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Amphenol Communications Solutions
Part No. 447-5010-062
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 10 positions, open, 6.25mm (0.246in), Header.
Tech specs 　 　

Official Product Page

    87759-1014

Molex Electronics Ltd.
Part No. 87759-1014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 420.16K  /  8 Page

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Texas Instruments
Part No. 5962-8775901MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

    87759-1015

Molex Electronics Ltd.
Part No. 87759-1015
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 279.46K  /  6 Page

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Texas Instruments
Part No. 5962-8775901M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs 　 　

Official Product Page

    87759-1465

Molex Electronics Ltd.
Part No. 87759-1465
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs,
File Size 280.39K  /  6 Page

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Texas Instruments
Part No. 5962-8775901MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    87759-1250

Molex Electronics Ltd.
Part No. 87759-1250
Description
File Size 174.22K  /  4 Page

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Amphenol Communications Solutions
Part No. 10144754-2211LF
Description Minitek® Pwr 3.0 BMI, Dual Row, Right Angle Through Hole Header, 80u\\ Tin overall plating, 22 Positions, Black Color, LCP, GW Compatible, Tray packing.
Tech specs 　 　

Official Product Page

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