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AD[Analog Devices] Analog Devices, Inc.
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Part No. |
AD8205YR-REEL7 AD8205 AD8205YCSURF AD8205YR AD8205YR-REEL AD8205YC-PT
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OCR Text |
...2 m x 92 m. Passivation type is 8ka USG (Oxide) + 10KA Oxynitride. Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu. Backside potential is V+.
Rev. 0 | Page 5 of 12
04315-0-026
VREF1 TOP VIEW 6 V+ (Not to Scale) NC 4 5 OU... |
Description |
Single Supply 42V System Difference Amplifier Single-Supply 42 V System Difference Amplifier Zero Drift, Digitally Programmable Instrumentation Amplifier; Package: LFCSP (4x4x.85mm, 2.10mm exposed pad); No of Pins: 16; Temperature Range: Industrial 10 MHz, 20 V/µs, G = 1, 2, 4, 8 iCMOS® Programmable Gain Instrumentation Amplifier; Package: EVALUATION BOARDS; No of Pins: -; Temperature Range: Industrial 3.3V, 2.5Gbps/2.7Gbps, SDH/SONET 4:1 Serializer with Clock Synthesis
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File Size |
302.00K /
12 Page |
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INTERSIL[Intersil Corporation]
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Part No. |
DG201_01 DG201 DG201CJ
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OCR Text |
...Thickness: 7kA Si3N4 Thickness: 8ka WORST CASE CURRENT DENSITY: 1 x 105 A/cm2
Metallization Mask Layout
DG201
D1 (2) S1 (3) IN1 (1) IN2 (16) D2 (15) (14) S2
V- (4)
(13) V+ (SUBSTRATE)
GND (5)
(12) VREF
S4 (6) (7) D4 (8) ... |
Description |
CMOS Quad SPST Analog Switch
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File Size |
130.75K /
7 Page |
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INTERSIL[Intersil Corporation]
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Part No. |
DG308A_01 DG308A DG308ACJ DG308ACY
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OCR Text |
...ss: 7kA 1.4kA Nitride Thickness:8ka 1.2kA WORST CASE CURRENT DENSITY: 9.1 x 104 A/cm 2
Metallization Mask Layout
DG308A
PIN 14 S2 PIN 13 V+ (SUBSTRATE) PIN 11 S3
PIN 15 D2
PIN 10 D3
PIN 16 IN2
PIN 9 IN3
PIN 1 D1
PIN 8... |
Description |
Quad Monolithic SPST, CMOS Analog Switch
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File Size |
145.64K /
7 Page |
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INTERSIL[Intersil Corporation]
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Part No. |
HA5352IP HA5352 HA5352IB
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OCR Text |
... - 4kA, Undoped Si Glass(USG) - 8ka, Total - 12kA SUBSTRATE POTENTIAL: VTRANSISTOR COUNT: 312
2kA
Metallization Mask Layout
HA5352
-IN1
GND1 GND1
V1+ V1+ V1+
S/H CONTROL1 +IN1
VOUT1 VOUT1
V1V1V1-
V2V2V2VOUT2
V... |
Description |
Fast Acquisition Dual Sample and Hold Amplifier
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File Size |
57.48K /
5 Page |
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Intersil
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Part No. |
5962R9571401QRC HS-82C08RH
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OCR Text |
...SIVATION: Type: SiO2 Thickness: 8ka 1kA
Metallization Mask Layout
HS-82C08RH
(20) VDD
A1 (2)
(19) B0
(1) A0
(18) B1
A2 (3)
(17) B2
A3 (4)
(16) B3
A4 (5)
(15) B4
A5 (6)
(14) B5
A6 (7)
(13) B6
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Description |
Radiation Hardened 8-Bit Bus Transceiver
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File Size |
49.13K /
7 Page |
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Intersil, Corp. INTERSIL[Intersil Corporation]
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Part No. |
HI1-5700S_883 HI-5700_883 HI-5700883 HI-5700/883 HI1-5700S/883
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OCR Text |
...SIVATION: Type: SiO2 Thickness: 8ka 1kA DIE ATTACH: Material: Gold Silicon Eutectic Alloy Temperature: Ceramic DIP - 460oC (Max) WORST CASE CURRENT DENSITY: 3.05 x 104 A/cm 2
Metallization Mask Layout
HI-5700/883
VREF AVDD CLK D5 D6 D... |
Description |
16 Characters x 1 Lines, 5x7 Dot Matrix Character and Cursor 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28 Subminiature PCB fuse, solderable into PCBs or fuseholder; Voltage Rating: 250V; Current Rating: 0.63A; Characteristic: Fast Acting 64 MACROCELL 3.3 VOLT ISP CPLD - NOT RECOMMENDED for NEW DESIGN 8-Bit, 20 MSPS Flash A/D Converter
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File Size |
564.23K /
8 Page |
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INTERSIL[Intersil Corporation]
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Part No. |
HI1-5701T_883 HI-5701_883 HI-5701883 HI-5701/883
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OCR Text |
...SIVATION: Type: SiO2 Thickness: 8ka 1kA DIE ATTACH: Material: Gold Silicon Eutectic Alloy Temperature: Ceramic DIP - 460oC (Max) WORST CASE CURRENT DENSITY: 3.05 x 104 A/cm2
Metallization Mask Layout
HI-5701/883
OVF
VSS
D5
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Description |
6-Bit, 30 MSPS Flash A/D Converter
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File Size |
59.17K /
8 Page |
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INTERSIL[Intersil Corporation]
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Part No. |
ID82C86H 82C86H 82C86H_04 82C86H04
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OCR Text |
...SIVATION: Type: SiO2 Thickness: 8ka 1kA
5
82C86H Metallization Mask Layout
82C86H
A2
A1
A0
VCC
B0
B1
B2
A3 A4 B3
B4
A5 B5 A6
A7
OE
GND
T
B7
B6
All Intersil U.S. products are manufac... |
Description |
CMOS Octal Bus Transceiver
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File Size |
127.73K /
6 Page |
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