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Amphenol Communications Solutions |
Part No. |
67998-266HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 66 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail
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Tech specs |
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Official Product Page
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MOTOROLA[Motorola, Inc] ONSEMI[ON Semiconductor]
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Part No. |
2N5555 ON0063
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Description |
CASE 29.04, STYLE 5 TO-92 (TO-226AA) CASE 29-4, STYLE 5TO-2 (TO-26AA) From old datasheet system JFET Switching
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File Size |
270.30K /
8 Page |
View
it Online |
Download Datasheet |
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Coilcraft Inc |
Part No. |
XFL2006-333MEB
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Description |
General Purpose Inductor, 33uH, 20%, 1 Element, Composite-Core, SMD, 0808, CHIP, 0808
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Tech specs |
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Official Product Page
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Coilcraft Inc |
Part No. |
XFL2006-333MEC
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Description |
General Purpose Inductor, 33uH, 20%, 1 Element, Composite-Core, SMD, 0808, CHIP, 0808
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Tech specs |
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Official Product Page
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Coilcraft Inc |
Part No. |
XFL2006-333
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Description |
Power inductor, shielded, 20% tol, SMT, RoHS
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Tech specs |
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Official Product Page
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Coilcraft Inc |
Part No. |
XFL2006-333ME
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Description |
Power inductor, shielded, 20% tol, SMT, RoHS
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Tech specs |
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Official Product Page
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Coilcraft Inc |
Part No. |
XFL2006-332
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Description |
Power inductor, shielded, 20% tol, SMT, RoHS
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Tech specs |
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Official Product Page
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Coilcraft Inc |
Part No. |
XFL2006-332ME
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Description |
Power inductor, shielded, 20% tol, SMT, RoHS
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Tech specs |
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Official Product Page
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Coilcraft Inc |
Part No. |
XFL2006-332MEB
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Description |
General Purpose Inductor, 3.3uH, 20%, 1 Element, Composite-Core, SMD, 0808, CHIP, 0808
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Tech specs |
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Official Product Page
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Coilcraft Inc |
Part No. |
XFL2006-332MEC
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Description |
General Purpose Inductor, 3.3uH, 20%, 1 Element, Composite-Core, SMD, 0808, CHIP, 0808
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
R7F7010063AFP
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Description |
High-end In-vehicle Microcomputers for Body Applications
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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