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For coat Found Datasheets File :: 1374    Search Time::0.984ms    
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    Motorola
Part No. MPX5500
OCR Text ...erential FLUORO SILICONE DIE coat DIE WIRE BOND +5 V STAINLESS STEEL METAL COVER P1 Vout Vs IPS 1.0 mF 0.01 mF GND 470 pF OUTPUT LEAD FRAME Motorola Sensor Device Data EEEEEEEEEEEE EEEEEEEEEEEE EEEEEEEEEEEE EEEEEEEEEEEE EEEE...
Description Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated

File Size 90.87K  /  6 Page

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    MPX5700 MPX5700D MPX5700DP MPX5700GP MPX5700GS MPX5700GSX

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MPX5700 MPX5700D MPX5700DP MPX5700GP MPX5700GS MPX5700GSX
OCR Text ...erential FLUORO SILICONE DIE coat DIE P1 WIRE BOND STAINLESS STEEL METAL COVER MPX5700 OUTPUT (PIN 1) 50 pF 51 k LEAD FRAME Motorola Sensor Device Data EEEEEEEEEEE EEEEEEEEEEE EEEEEEEEEEE EEEEEEEEEEE EEEEEEEEEEE P2 EPOXY ...
Description INTEGRATED PRESSURE SENSOR 0 to 700 kPa (0 to 101.5 psi) 0.2 to 4.7 V OUTPUT DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, 0-101.52Psi, 2.5%, 0.20-4.70V, THROUGH HOLE MOUNT

File Size 146.00K  /  8 Page

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    CY7C166-15PC CY7C166-15VC CY7C164 CY7C164-15PC CY7C164-15VC CY7C164-20PC CY7C166-20PC CY7C166-20VC CY7C164-25PC CY7C164-

CYPRESS[Cypress Semiconductor]
Cypress Semiconductor Corp.
Cypress Semiconductor, Corp.
Part No. CY7C166-15PC CY7C166-15VC CY7C164 CY7C164-15PC CY7C164-15VC CY7C164-20PC CY7C166-20PC CY7C166-20VC CY7C164-25PC CY7C164-20VC CY7C164-35VC CY7C166 CY7C166-35VC CY7C164-25VC CY7C164-35PC CY7C166-25PC CY7C166-25VC CY7C166-35PC
OCR Text ...OE) is HIGH for CY7C166). A die coat is used to insure alpha immunity. Functional Description The CY7C164 and CY7C166 are high-performance CMOS static RAMs organized as 16,384 by 4 bits. Easy memory expansion is provided by an active LO...
Description 16K x 4 Static RAM 16K X 4 STANDARD SRAM, 25 ns, PDSO24

File Size 169.90K  /  9 Page

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    Motorola
Part No. MPX4080D
OCR Text ...tial FLUORO SILICONE GEL DIE coat WIRE BOND DIE STAINLESS STEEL METAL COVER EPOXY PLASTIC CASE LEAD FRAME Figure 3 illustrates the differential sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates ...
Description MPX4080D Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated

File Size 74.67K  /  8 Page

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    Motorola
Part No. MPX5010 MPXV5010G
OCR Text ...ange. FLUOROSILICONE GEL DIE coat P1 WIRE BOND DIE STAINLESS STEEL CAP +5 V Vout OUTPUT THERMOPLASTIC CASE 1.0 mF 0.01 mF Vs IPS GND 470 pF LEAD FRAME P2 DIFFERENTIAL SENSING ELEMENT DIE BOND Figure 2. Cross-Sect...
Description Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated

File Size 213.11K  /  16 Page

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    MPX5999D MPX5999

Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX5999D MPX5999
OCR Text ...re Differential SILICONE DIE coat DIE P1 WIRE BOND STAINLESS STEEL METAL COVER MPX5999D OUTPUT (PIN 1) 50 pF 51 k A/D LEAD FRAME Motorola Sensor Device Data EEEEEEEEEEEE EEEEEEEEEEEE EEEEEEEEEEEE EEEEEEEEEEEE P2 THERMO...
Description X-ducer SILICON PRESSURE SENSORS

File Size 81.28K  /  6 Page

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    466 0466002.

Littelfuse
Part No. 466 0466002.
OCR Text ...Copper/Nickel/Tin Element Cover coat: Conformal coating Soldering Parameters(see page 3 for soldering profile): Wave Solder -- 260C, 10 seconds max Reflow Solder -- 260C, 30 seconds max 364 w w w. l i t t e l f u s e . c o m Su...
Description Surface Mount Fuses - Lead-Free Thin-Film

File Size 72.88K  /  2 Page

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    CDALA10M7GA019 CDACV10M7GA001-R0

Murata Manufacturing Co., Ltd.
Part No. CDALA10M7GA019 CDACV10M7GA001-R0
OCR Text ...se of covering filter with over coat, conditions such as material of resin, cure temperature, and so on should be evaluated well. 9. Do not use strong acidity flux, more than 0.2wt% chlorine content, in re-flow soldering. 10. Accurate test ...
Description Ceramic Filters (CERAFIL) for FM Receivers

File Size 921.25K  /  57 Page

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    CYPRESS[Cypress Semiconductor]
Part No. CY7C182 7C182 CY7C182-45PC CY7C182-25PC CY7C182-25VC CY7C182-35PC CY7C182-35VC CY7C182-45VC CY7C182-20PC
OCR Text ...rite enable (WE) is HIGH. A die coat is used to insure alpha immunity. Functional Description The CY7C182 is a high-speed CMOS static RAM organized as 8,192 by 9 bits and it is manufactured using Cypress's highperformance CMOS technolog...
Description Memory : Async SRAMs
8Kx9 Static RAM
From old datasheet system

File Size 141.46K  /  6 Page

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    Motorola
Part No. MPXV10GC MPX10
OCR Text ...tion Comparison SILICONE DIE coat WIRE BOND DIE LEAD FRAME Figure 4. Unibody Package -- Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A ...
Description MPX10 10 kPa Uncompensated Silicon Pressure Sensors
10 kPa Uncompensated Silicon Pressure Sensors

File Size 151.56K  /  8 Page

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