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  GDM-8246 Datasheet PDF File

For GDM-8246 Found Datasheets File :: 105+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 |   

    Freescale Semiconductor
Part No. MC56F8246 MC56F8256 MC56F8255 MC56F8257 MC56F825X MC56F824X MC56F8247
Description (MC56F824x / MC56F825x) Digital Signal Controller Battery chargers and management

File Size 4,031.82K  /  88 Page

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Amphenol Communications Solutions

Part No. 77313-824-68LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 68 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    GDMQ0704 GDMQ0705 GDMQ0706 GDMQ0709 GDMQ0710 GDMQ0712 GDMQ0812

Vishay Siliconix
Part No. GDMQ0704 GDMQ0705 GDMQ0706 GDMQ0709 GDMQ0710 GDMQ0712 GDMQ0812
Description Ceramic Capacitor Stacks

File Size 95.44K  /  2 Page

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Amphenol Communications Solutions

Part No. 77313-824-66LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions
Tech specs    

Official Product Page

    HY27UH088G2M HY27UH088GDM

Hynix Semiconductor
Part No. HY27UH088G2M HY27UH088GDM
Description 8G-Bit NAND Flash Memory

File Size 461.58K  /  53 Page

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Amphenol Communications Solutions

Part No. 48246-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs    

Official Product Page

    HY27UH08AG5M HY27UH08AGDM HY27UH08AGDM-MPEB

Hynix Semiconductor, Inc.
Part No. HY27UH08AG5M HY27UH08AGDM HY27UH08AGDM-MPEB
Description 16Gbit (2Gx8bit) NAND Flash
2G X 8 FLASH 3.3V PROM, 25 ns, PBGA52 12 X 17 MM, 1 MM HEIGHT, LEAD FREE, TLGA-52

File Size 352.98K  /  49 Page

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Amphenol Communications Solutions

Part No. 68482-460HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Hynix Semiconductor, Inc.
Part No. HY27UH088GDM-MPEB HY27UH088G2M-TIS HY27UH088G2M-TIB HY27UH088G2M-TIP
Description 1G X 8 FLASH 3.3V PROM, 30 ns, PBGA52 12 X 17 MM, 1 MM HEIGHT, LEAD FREE, TLGA-52
1G X 8 FLASH 3.3V PROM, 30 ns, PDSO48 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48

File Size 445.48K  /  53 Page

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Amphenol Communications Solutions

Part No. RJE451882461
Description Modular Jack - High Performance, Input Output Connectors 8P8C, Vertical, CAT6, Shield, With LEDs.
Tech specs    

Official Product Page

    B82464-A4152-M B82464-A4222-M B82464-A4684-K B82464-A4 B82464-A4102-M B82464-A4103-M B82464-A4104-K B82464-A4105-K B8246

EPCOS AG
EPCOS[EPCOS]
Part No. B82464-A4152-M B82464-A4222-M B82464-A4684-K B82464-A4 B82464-A4102-M B82464-A4103-M B82464-A4104-K B82464-A4105-K B82464-A4153-K B82464-A4154-K B82464-A4223-K B82464-A4224-K B82464-A4333-K B82464-A4362-M B82464-A4472-M B82464-A4473-K B82464-A4474-K B82464-A4682-M B82464-A4683-K B82464-A4334-K
Description 1 ELEMENT, 4.7 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
SMT-Power-Inductors

File Size 73.53K  /  3 Page

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Amphenol Communications Solutions

Part No. RJE451882461T
Description Modular Jack - 8P8C, Vertical, Cat6, THR, No Panel Stops, Single Port, Shield With No Tabs, With LEDs
Tech specs    

Official Product Page

    HY27UG084G2M HY27UG084G2D HY27UG084GDM

Hynix Semiconductor
Part No. HY27UG084G2M HY27UG084G2D HY27UG084GDM
Description (HY27UGxx Series) 2G-Bit NAND Flash

File Size 466.48K  /  53 Page

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Amphenol Communications Solutions

Part No. 77313-824-64LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 64 Positions
Tech specs    

Official Product Page

    B25836B8246A305

EPCOS
Part No. B25836B8246A305
Description Film capacitors - Power Factor Correction

File Size 451.53K  /  9 Page

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Amphenol Communications Solutions

Part No. 68482-468HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    B78476A8246A003

EPCOS
Part No. B78476A8246A003
Description Magnetics modules for LAN applications

File Size 259.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 67998-246HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail
Tech specs    

Official Product Page

    230-018126P 230-018206P 230-018226P 230-018106P 230-018146P 230-018166P 230-018186P 230-018246P

Glenair, Inc.
Part No. 230-018126P 230-018206P 230-018226P 230-018106P 230-018146P 230-018166P 230-018186P 230-018246P
Description Hermetic Receptacle, Solder Flange Mount

File Size 288.47K  /  2 Page

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Amphenol Communications Solutions

Part No. RJE4A1882461
Description Modular Jacks, Input Output Connectors 8P8C, Vertical, CAT6A, Shield, With LEDs
Tech specs    

Official Product Page

For GDM-8246 Found Datasheets File :: 105+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 |   

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