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moulding Datasheet PDF File

For moulding Found Datasheets File :: 308 Search Time::1.984ms
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				International Rectifier
Part No.	IRFI9610GPBF
OCR Text	...ialindustrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	HEXFET POWER MOSFET
File Size	210.61K / 8 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRFI9Z24N
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	-55V Single P-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package HEXFET Power MOSFET
File Size	113.08K / 8 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRFI1010NPBF IRFI1010NPBF-15
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	ADVANCED PROCESS TECHNOLOGY HEXFET㈢ Power MOSFET HEXFET? Power MOSFET
File Size	227.74K / 9 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRFI3205PBF
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	HEXFET? Power MOSFET HEXFET㈢ Power MOSFET
File Size	266.46K / 9 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRFI530NPBF IRFI530NPBF-15
OCR Text	...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description	HEXFET? Power MOSFET HEXFET㈢ Power MOSFET ADVANCED PROCESS TECHNOLOGY
File Size	221.57K / 9 Page	View it Online	Download Datasheet

				TT Electronics / Welwyn Welwyn Components Limited
Part No.	WH25 WH10 WH5 WH50
OCR Text	...ere are no flux residues on the moulding compound, otherwise insulation resistance will be reduced. Packaging Resistors are packed in plastic bags and boxed for maximum protection. (c) Welwyn Components Limited Bedlington, Northumber...
Description	Aluminium Housed Wirewound Resistors
File Size	68.18K / 3 Page	View it Online	Download Datasheet

				EPCOS[EPCOS]
Part No.	B37872K5105K072 B37872K5105K0 B37872K5105K062
OCR Text	...sing - care must be taken using moulding processes. Combined stresses - the total stress (e.g. DC voltage, AC ripple, pulses and temperature) has to be taken into account to estimate reliability of MLCC. KB VS PE Please read Cautions and...
Description	Multilayer ceramic capacitor
File Size	55.35K / 5 Page	View it Online	Download Datasheet

				EPCOS[EPCOS]
Part No.	B37931K5104K070 B37931K5104K0 B37931K5104K060
OCR Text	...sing - care must be taken using moulding processes. Combined stresses - the total stress (e.g. DC voltage, AC ripple, pulses and temperature) has to be taken into account to estimate reliability of MLCC. KB VS PE Please read Cautions and...
Description	Multilayer ceramic capacitor
File Size	55.50K / 5 Page	View it Online	Download Datasheet

				EPCOS[EPCOS]
Part No.	B37941K5105K072 B37941K5105K0 B37941K5105K062
OCR Text	...sing - care must be taken using moulding processes. Combined stresses - the total stress (e.g. DC voltage, AC ripple, pulses and temperature) has to be taken into account to estimate reliability of MLCC. KB VS PE Please read Cautions and...
Description	Multilayer ceramic capacitor
File Size	55.77K / 5 Page	View it Online	Download Datasheet

				EPCOS[EPCOS]
Part No.	B37941K5474K072 B37941K5 B37941K5474K060 B37941K5474K062 B37941K5474K070
OCR Text	...sing - care must be taken using moulding processes. Combined stresses - the total stress (e.g. DC voltage, AC ripple, pulses and temperature) has to be taken into account to estimate reliability of MLCC. KB VS PE Please read Cautions and...
Description	Multilayer ceramic capacitor
File Size	55.90K / 5 Page	View it Online	Download Datasheet

For moulding Found Datasheets File :: 308 Search Time::1.984ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |