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  package-57 Datasheet PDF File

For package-57 Found Datasheets File :: 41476    Search Time::1.453ms    
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    LTC2755CUP-12-PBF LTC2755CUP-12-TRPBF LTC2755CUP-14-PBF LTC2755CUP-14-TRPBF LTC2755BCUP-16-PBF LTC2755ACUP-16-PBF LTC275

Linear Technology
Part No. LTC2755CUP-12-PBF LTC2755CUP-12-TRPBF LTC2755CUP-14-PBF LTC2755CUP-14-TRPBF LTC2755BCUP-16-PBF LTC2755ACUP-16-PBF LTC2755BCUP-16-TRPBF LTC2755ACUP-16-TRPBF LTC2755AIUP-16-PBF LTC2755AIUP-16-TRPBF LTC2755BIUP-16-PBF LTC2755BIUP-16-TRPBF LTC2755IUP-12-PBF LTC2755IUP-12-TRPBF LTC2755IUP-14-PBF LTC2755IUP-14-TRPBF
OCR Text ...eset to 0V 64-Pin 9mm x 9mm QFN Package APPLICATIONS High Resolution Offset and Gain Adjustment Process Control and Industrial Au...57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 D/S S2 1 S0 IOUT2A 2 IOUT...
Description Quad Current Output 12-/14-/16-Bit SoftSpan DACs with Parallel I/O

File Size 418.30K  /  24 Page

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    IRFP044 IRFP044PBF SIHFP044 SIHFP044-E3

Vishay Siliconix
Part No. IRFP044 IRFP044PBF SIHFP044 SIHFP044-E3
OCR Text ... cost-effectiveness. The TO-247 package is preferred for commercial-industrial applications where higher power levels preclude the use of TO...57 40 230 1.2 53 180 4.5 - 55 to + 175 300d 10 1.1 W/C mJ W V/ns C lbf * in N*m A UNIT V Notes a....
Description Power MOSFET

File Size 1,992.98K  /  8 Page

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    HYB18T512800AF-3 HYB18T512800AF-3.7 HYB18T512800AF-3S HYB18T512800AF-5 HYB18T512800ALF-3.7 HYB18T512400AFL-3.7 HYB18T512

Qimonda AG
Part No. HYB18T512800AF-3 HYB18T512800AF-3.7 HYB18T512800AF-3S HYB18T512800AF-5 HYB18T512800ALF-3.7 HYB18T512400AFL-3.7 HYB18T512160AFL-3.7 HYB18T512160AF-3 HYB18T512160AF-3.7 HYB18T512160AF-3S
OCR Text ...2 SDRAM is available in P-TFBGA package. The 512-Mbit DDR2 DRAM is a high-speed Double-DataRate-Two CMOS Synchronous DRAM device containi...57 12 12 Max. 8 8 8 70000 -- -- -- DDR2-667D -3S 5-5-5 Min. 5 3.75 3 45 60 15 15 Max. 8 8 8 70000...
Description 512-Mbit Double-Data-Rate-Two SDRAM

File Size 1,471.21K  /  58 Page

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    HD4074019 HD4074019C HD4074019FS HD4074019H HD4074019S HD40L4019R HD40L4019RH HD40L4019RS HD404019RS HD404019R

Renesas Electronics Corporation
Part No. HD4074019 HD4074019C HD4074019FS HD4074019H HD4074019S HD40L4019R HD40L4019RH HD40L4019RS HD404019RS HD404019R
OCR Text ...lastic DIP 64-pin flat plastic package 64-pin shrink type ceramic DIP with window Ordering Information Type Mask ROM Product Name HD40...57 56 55 54 53 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 3...
Description CMOS 4-bit single-chip microcomputers

File Size 243.17K  /  65 Page

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    BY26805 BY268 BY269

Vishay Siliconix
Part No. BY26805 BY268 BY269
OCR Text ...ed junction Hermetically sealed package e2 Lead (Pb)-free component Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Applic...57 Sintered glass case Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Pol...
Description Fast Avalanche Sinterglass Diode

File Size 125.06K  /  5 Page

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    MB89P627 MB89P627PF MB89P627PFM MB89P627-SH MB89T625 MB89T625PF MB89T625PFM MB89T625PFV MB89T625P-SH MB89623 MB89623PF M

FUJITSU[Fujitsu Media Devices Limited]
Part No. MB89P627 MB89P627PF MB89P627PFM MB89P627-SH MB89T625 MB89T625PF MB89T625PFM MB89T625PFV MB89T625P-SH MB89623 MB89623PF MB89623PFM MB89623PFV MB89623P-SH MB89625 MB89625PF MB89625PFM MB89625PFV MB89625P-SH MB89626 MB89626PF MB89626PFM MB89626P-SH MB89627 MB89627PF MB89627PFM MB89627P-SH MB89P625PFM MB89P625P-SH MB89P625PF MB89W627C-SH MB89P625 MB89PV620 MB89PV620CF MB89PV620C-SH MB89T623 MB89T623PF MB89T623PFM MB89T623PFV MB89T623P-SH MB89V623 MB89V623P-SH MB89V625 MB89V625P-SH MB89W625 MB89W625C-SH MB89W627
OCR Text ...oller. s FEATURES * Various package options Three types of QFP packages (1-mm, 0.65-mm, or 0.5-mm lead pitch) SDIP packages * High-speed...57 A11 87 56 OE 86 55 A10 85 54 CE 84 53 O8 83 52 O7 82 51 O6 81 50 O5 80 49 O4 79 48 47 46 45 44 Ea...
Description 8-bit Proprietary Microcontroller

File Size 454.76K  /  61 Page

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    BY448 BY44805 BY458

Vishay Siliconix
Part No. BY448 BY44805 BY458
OCR Text ...ed junction Hermetically sealed package e2 Lead (Pb)-free component Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Applic...57 Sintered glass case Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Pol...
Description Standard Avalanche Sinterglass Diode

File Size 118.69K  /  5 Page

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    2SC5543YA-TR-E

Renesas Electronics Corporation
Part No. 2SC5543YA-TR-E
OCR Text ...05 Features * Super compact package; (1.4 x 0.8 x 0.59mm) * Capable low voltage operation ; (VCE = 1V) Outline RENESAS Package code:...57 9.14 7.90 6.91 6.12 5.49 4.96 4.52 4.16 3.86 3.59 3.36 3.17 3.00 2.83 2.71 2.59 2.47 S21 ANG 162....
Description Silicon NPN Epitaxial VHF / UHF wide band amplifier

File Size 166.10K  /  8 Page

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    TAOS
Part No. TCS3200 TCS3210
OCR Text ...nd rohs compliant surface-mount package description the tcs3200 and tcs3210 programmable color light-to-frequency converters that comb...57% 80% 9% 27% khz (note 9) e e = 34.6 w/cm 2 , p = 640 nm (4.9) (6.1...
Description PROGRAMMABLE COLOR LIGHT-TO-FREQUENCY CONVERTER

File Size 182.04K  /  14 Page

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For package-57 Found Datasheets File :: 41476    Search Time::1.453ms    
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