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ON Semi
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| Part No. |
TRA3225 ON2998
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| OCR Text |
... -65 to +175
Amps C C
(c) semiconductor Components Industries, LLC, 1999
1
December, 1999 - Rev. 0
Publication Order Number: ...metal areas are also tin plated to enhance solderability. In the soldering process it is important t... |
| Description |
250 Volts, 32 Amperes
From old datasheet system
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| File Size |
118.94K /
8 Page |
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it Online |
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OKI electronic components
OKI[OKI electronic componets]
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| Part No. |
MG65P MG63P MG64P
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| OCR Text |
...effective) CMOS technology. The semiconductor process is adapted from Oki's production-proven 64- Mbit DRAM manufacturing process. The 0.25 ...metal MG63P/64P/65P CSA series contains 21 devices each, offering up to 868 I/O pads and over 5.4M r... |
| Description |
0.25m Embedded DRAM/ Customer Structured Arrays
0.25レm Embedded DRAM/ Customer Structured Arrays
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| File Size |
125.78K /
22 Page |
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it Online |
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AGILENT TECHNOLOGIES
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| Part No. |
HSMS-2700
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| OCR Text |
...y device is a rectifying, metal-semiconductor contact formed between a metal and an n-doped or a p-doped semiconductor. When a metalsemiconductor junction is formed, free electrons flow across the junction from the semiconductor and fill th... |
| Description |
High Power Clipping/clamping Diode
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| File Size |
77.36K /
8 Page |
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it Online |
Download Datasheet |
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Price and Availability
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