| |
|
 |
TriQuint Semiconductor, Inc.
|
| Part No. |
AP501
|
| OCR Text |
... 2. the area around the module underneath the pcb should not contain any soldermask in order to maintain good rf grounding. 3. for proper and safe operation in the laboratory, the power-on sequencing should be followed: a. connect rf... |
| Description |
|
| File Size |
837.65K /
5 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Integrated Device Technology, Inc.
Ecliptek, Corp.
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part No. |
ICS557GI-06LFT ICS557G-06LFT ICS557G-06T ICS557-06
|
| OCR Text |
...his includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. external components a minimum number of external components are required for proper operation. decoupling capacitor... |
| Description |
1 TO 4 HCSL CLOCK BUFFER 557 SERIES, LOW SKEW CLOCK DRIVER, 4 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20
|
| File Size |
242.84K /
11 Page |
View
it Online |
Download Datasheet |
| |
|
|
ICST
|
| Part No. |
ICS557-08
|
| OCR Text |
...his includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device.
Load Resistors RL
Since the clock outputs are open source outputs, 50 external resistors to ground are to be conn... |
| Description |
2:1 MULTIPLEXER CHIP
|
| File Size |
203.92K /
11 Page |
View
it Online |
Download Datasheet |
| |
|
|
ICST
|
| Part No. |
ICS557-06
|
| OCR Text |
...his includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device.
Load Resistors RL
Since the clock outputs are open source outputs, 50 ohm external resistors to ground are to be ... |
| Description |
ONE TO FOUR HCSL CLOCK BUFFER
|
| File Size |
214.93K /
10 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
