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Monolithic Power System...
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| Part No. |
MP92325 MP92325GJ
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| OCR Text |
...th wide pcb traces and multiple vias. 3 sw switch output. connect sw to the inductor and bootstrap capacitor. sw is driven up to v in by the high-side switch during the pwm dut y cycle on time. the inductor current drives sw negative d... |
| Description |
24V, 3A, 500kHz, High-Efficiency, Synchronous, Step-Down Converter
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| File Size |
738.30K /
16 Page |
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it Online |
Download Datasheet
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Monolithic Power System...
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| Part No. |
MP2324
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| OCR Text |
...wide pc b traces and multiple vias . 3 sw switch output. connect to the inductor and bootstrap capacitor. this pin is driven up to vin by the high - side switch during the pwm duty cycle on time. the ind... |
| Description |
High Efficiency 2A, 24V, 500kHz Synchronous Step-Down Converter
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| File Size |
988.76K /
17 Page |
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it Online |
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Infineon Technologies A...
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| Part No. |
ITS4100S-SJ-N
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| OCR Text |
...nction to ambient with thermal vias - 2s2p r thja_2s2p 58.4 k/w 6) 6) specified r thja value is according to jedec jesd51-2,-5,-7 at natural convection on fr4 2s2p board with two thermal vias; the product (chip+package) was simulated o... |
| Description |
Smart High-Side NMOS-Power Switch
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| File Size |
1,572.66K /
20 Page |
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it Online |
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WJCI[WJ Communication. Inc.]
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| Part No. |
HMJ8_07 HMJ8 HMJ8-PCB HMJ807
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| OCR Text |
...unting Config. Notes
1. Ground vias are critical for thermal and RF grounding considerations. 2. A minimum of 28 ground vias are required for 14 mil FR4 boards. 3. If your PCB design rules allow, ground vias should be placed under the land... |
| Description |
High Dynamic Range FET Mixer
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| File Size |
435.44K /
3 Page |
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it Online |
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Integrated Device Techn...
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| Part No. |
844008AKI-46LF 844008AKI-46LFT 844008I-46
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| OCR Text |
... the power supply plane through vias, and 0.01f bypass capacitors should be used for each pin. figure 1 illustrates this for a generic v cc pin and also shows that v dda requires that an additional 10 ... |
| Description |
FemtoClock Crystal-to-LVDS Clock Generator
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| File Size |
306.75K /
16 Page |
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it Online |
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FILTRONIC[Filtronic Compound Semiconductors]
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| Part No. |
FPDA200V
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| OCR Text |
... Power-Added Efficiency Source vias to Backside Metallization
FPDA200V
HIGH PERFORMANCE PHEMT WITH SOURCE vias
GATE BOND PAD
DRAIN BOND PAD
DIE SIZE: 15.6X13.2 mils (395x335 m) DIE THICKNESS: 3.9 mils (100 m) BONDING PADS: 3... |
| Description |
HIGH PERFORMANCE PHEMT WITH SOURCE vias
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| File Size |
57.15K /
3 Page |
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it Online |
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FILTRONIC[Filtronic Compound Semiconductors]
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| Part No. |
FPD4000V
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| OCR Text |
... Operation / Plated Source Thru-vias
FPD4000V
4W POWER PHEMT
DRAIN BOND PAD (4X)
GATE BOND PAD (4X)
*
DESCRIPTION AND APPLICATIONS
DIE SIZE (m): 650 x 1300 DIE THICKNESS: 100 m BONDING PADS (m): >70 x 65
The FPD4000V i... |
| Description |
4W POWER PHEMT
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| File Size |
239.62K /
3 Page |
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it Online |
Download Datasheet |
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Price and Availability
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