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  43045-0819 Datasheet PDF File

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    43045-1208

Molex Electronics Ltd.
Part No. 43045-1208
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

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HUA FENG CIRCUIT





    43045-1201

Molex Electronics Ltd.
Part No. 43045-1201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-1200

Molex Electronics Ltd.
Part No. 43045-1200
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits
File Size 190.60K  /  3 Page

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Renesas Electronics Corporation
Part No. RJK0819DSP-00#J0
Description Nch Dual Power Mosfet 80V 2.4A 175Mohm Sop8
Tech specs 　 　

Official Product Page

    43045-1206

Molex Electronics Ltd.
Part No. 43045-1206
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits
File Size 184.20K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-809081900LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 8 Positions
Tech specs 　 　

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    43045-1601

Molex Electronics Ltd.
Part No. 43045-1601
Description
File Size 190.62K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-811081900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-0410

Molex Electronics Ltd.
Part No. 43045-0410
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 4 Circuits
File Size 180.68K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-112081950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    43045-1615

Molex Electronics Ltd.
Part No. 43045-1615
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 16 Circuits
File Size 174.04K  /  3 Page

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Amphenol Communications Solutions
Part No. 57102-F08-19LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 38 Positions - 2mm (0.079inch) - Vertical
Tech specs 　 　

Official Product Page

    43045-0610

Molex Electronics Ltd.
Part No. 43045-0610
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 6 Circuits
File Size 180.50K  /  3 Page

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Amphenol Communications Solutions
Part No. 57102-S08-19LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions
Tech specs 　 　

Official Product Page

    43045-1814

Molex Electronics Ltd.
Part No. 43045-1814
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits
File Size 166.55K  /  3 Page

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    43045-1815

Molex Electronics Ltd.
Part No. 43045-1815
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits
File Size 174.05K  /  3 Page

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