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Molex Electronics Ltd.
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| Part No. |
0736443001 73644-3001
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
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| File Size |
174.87K /
4 Page |
 View
it Online |
Download Datasheet
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Rochester Electronics LLC |
| Part No. |
ELANSC300-33VC
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| Description |
Microcontroller, 32-Bit, 33MHz, CMOS, PQFP208, TQFP-208
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
ELANSC300-33KC-G
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| Description |
ELANSC300 - Microcontroller, 32-Bit CPU
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736443007 73644-3007
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 144 Circuits
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| File Size |
174.33K /
4 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
H5N3003P-E
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| Description |
Nch Single Power Mosfet 300V 40A 69Mohm To-3P
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736443008 73644-3008
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits
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| File Size |
174.33K /
4 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
ISL33003IUZ-T
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| Description |
I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736443009 73644-3009
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 144 Circuits
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| File Size |
174.33K /
4 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
ISL33003IRTZ
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| Description |
I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736443011 73644-3011
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position F, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position F, 144 Circuits
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| File Size |
174.33K /
4 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0736443013 73644-3013
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position G, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position G, 144 Circuits
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| File Size |
174.33K /
4 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0736443018 73644-3018
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 144 Circuits
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| File Size |
174.33K /
4 Page |
View
it Online |
Download Datasheet |
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