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Analog Devices |
| Part No. |
110416-HMC452ST89
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| Description |
HMC452ST89 Evaluation PCB, 470
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| Tech specs |
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Official Product Page
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Analog Devices |
| Part No. |
EVAL-CN0416-ARDZ
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| Description |
Isolated and non-isolated RS-4
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R1LV0416DBG-7LI#S0
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| Description |
Low Power SRAM, TFBGA, /Embossed Tape
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| Tech specs |
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Official Product Page
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Belden, Inc.
Molex, Inc.
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| Part No. |
87049-0416 87049-2016 87049-0616 87049-1016
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| Description |
STIFTLEISTE WINKEL RASTER 2.0MM 2X2POL
STIFTLEISTE WINKEL RASTER 2.0MM 2X10POL STIFTLEISTE克尔栅格2.0MM 2X10POL
STIFTLEISTE WINKEL RASTER 2.0MM 2X3POL STIFTLEISTE克尔栅格2.0MM 2X3POL
STIFTLEISTE WINKEL RASTER 2.0MM 2X5POL STIFTLEISTE克尔栅格2.0MM 2X5POL
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| File Size |
51.55K /
1 Page |
 View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
| Part No. |
RMLV0416EGBG-4S2#KC0
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| Description |
4Mb Advanced LPSRAM (256-kword × 16-bit)
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
RMLV0416EGSB-4S2#HA0
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| Description |
4Mb Advanced LPSRAM (256-kword x 16-bit), TSOP(44), /Embossed Tape
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-5016 0877585016
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
R1RW0416DSB-0PI#S0
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| Description |
Wide Temperature Range Version 4M High-speed SRAM (256-kword x 16-bit), TSOP(44), /Embossed Tape
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R1LV0416DSB-7LI#S0
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| Description |
Low Power SRAM, TSOP(2), /Embossed Tape
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R1LV0416DBG-7LI#B0
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| Description |
Low Power SRAM, TFBGA, /Tray
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R1LV0416DSB-7LI#B0
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| Description |
Low Power SRAM, TSOP(2), /Tray
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877584617 87758-4617
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.70K /
4 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
R1RW0416DSB-0PR#S1
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| Description |
4M High-speed SRAM (256-kword × 16-bit)
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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