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Eaton All Rights Reserv...
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| Part No. |
HC3-2R2-R HC3-3R3-R HC3-4R7-R HC3-5R6-R HC3-6R0-R
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| OCR Text |
... plus self-temperature rise) ? solder reflow temperature: j-std-020d compli - ant. packaging ? supplied in bulk packaging, 24 parts per tray hc3 high current power inductors pb effective february 2017 supersedes october 2015
2 technic... |
| Description |
High current power inductors
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| File Size |
259.69K /
4 Page |
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it Online |
Download Datasheet
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Everlight Electronics C...
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| Part No. |
EAIST1005A0
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| OCR Text |
...infrared and vapor phase reflow solder process. ? pb free ? the product itself will remain within rohs compliant version. description ? eaist1005 is an infrared emitting diode in miniature smd package which is molded in a wate... |
| Description |
High reliability
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| File Size |
466.20K /
8 Page |
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it Online |
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Microsemi
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| Part No. |
1N5552USE3
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| OCR Text |
...0 400 600 800 1000 v solder temperature @ 10 s t sp 260 o c see notes on next page. downloaded from: http:///
t4 - lds - 0230 - 1, rev . 1 (111 901 ) ?2011 microsemi corporation page 2 of 5 1n5550us thr... |
| Description |
Standard Rectifier (trr more than 500ns)
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| File Size |
135.86K /
5 Page |
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it Online |
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Philips
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| Part No. |
CGY2105ATS/C1
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| OCR Text |
...ering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.... |
| Description |
CGY2105ATS; High dynamic range dual LNA MMIC
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| File Size |
88.58K /
16 Page |
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it Online |
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Philips
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| Part No. |
CGY2032TSC1
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| OCR Text |
...ering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.... |
| Description |
DECT 500 mW power amplifier
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| File Size |
61.54K /
12 Page |
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it Online |
Download Datasheet |
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Philips
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| Part No. |
CGY2030MC1
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| OCR Text |
...ages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.... |
| Description |
DECT 500 mW power amplifier
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| File Size |
94.58K /
12 Page |
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it Online |
Download Datasheet |
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Price and Availability
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