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TRINAMIC
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Part No. |
TMC332
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OCR Text |
...he evaluation board are 153mm x 100mm. Four mounting holes with a diameter of 3.2mm are located at the corners of the board, with the centers located 3.5mm from the edges.
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Electrical Characteristics
Nominal operating voltage: 24... |
Description |
Evaluation Board
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File Size |
1,071.79K /
13 Page |
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MICROSEMI[Microsemi Corporation]
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Part No. |
MXP1144
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OCR Text |
...REVIEW
Typical location with 100mm diameter photovoltaic cell
W W W.Microsemi .COM
diode location
MECHANICALS MECHANICALS
Copyright 2002 MXP1144.PDF, 2002-05-01
Microsemi
Santa Ana Division 2830 South Fairview, Santa Ana... |
Description |
Solar Array Diode Photovoltaic By-Pass Diode 50 Volts, 1.0 Amps
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File Size |
172.47K /
4 Page |
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it Online |
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MICROSEMI[Microsemi Corporation]
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Part No. |
MXP1144P
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OCR Text |
...REVIEW
Typical location with 100mm diameter photovoltaic cell
WWW .Microsemi .C OM
diode location
MECHANICALS MECHANICALS
Copyright (c) 2002 MXP1144.PDF, 2003-08-15
Microsemi
Santa Ana Division 2830 South Fairview, Santa An... |
Description |
Solar Array Diode PHOTOVOLTAIC BY-PASS DIODE 50 VOLTS, 1.0 Amps
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File Size |
74.46K /
4 Page |
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it Online |
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ROHM[Rohm]
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Part No. |
KD3004-DC10A
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OCR Text |
...d perform high printing 4 IPS. (100mm / s) 3) Available for thermal transfer printing by adopting specific partial glaze.
External dimens...diameter Running life / pulse life Operating temperature Symbol - - - Rave VH PO SLT - - - - - Typ. ... |
Description |
Thick Film Thermal Printhead (300dpi)
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File Size |
78.06K /
5 Page |
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it Online |
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RF MICRO DEVICES INC
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Part No. |
SDA-5000SB
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OCR Text |
...4 mil) 4. typical bond pad is 0.100mm square 5. backside metallization: gold 6. backside metal is ground 7. bond pad metallization: gold
...diameter bondwi res. the spacing between the test interface and the die was 200 m, and the bond wi... |
Description |
0 MHz - 35000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
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File Size |
557.80K /
8 Page |
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it Online |
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Price and Availability
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