325mm pdf Datasheet P9 Full Text Search --- IC-ON-LINE


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325mm Datasheet PDF File

For 325mm Found Datasheets File :: 214 Search Time::0.703ms
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Part No.	U0402FC36C U0402FC05C U0402FC08C U0402FC12C U0402FC15C U0402FC24C U0402FC3.3C U0402FC33C
OCR Text	... Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperat...
Description	UNBUMPED FLIP CHIP ARRAY
File Size	76.18K / 5 Page	View it Online	Download Datasheet

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Part No.	U0404FC36C U0404FC05C U0404FC08C U0404FC12C U0404FC15C U0404FC24C U0404FC3.3C U0404FC33C
OCR Text	... Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperat...
Description	UNBUMPED FLIP CHIP ARRAY
File Size	98.88K / 6 Page	View it Online	Download Datasheet

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Part No.	U0406FC36C U0406FC05C U0406FC08C U0406FC12C U0406FC15C U0406FC24C U0406FC3.3C U0406FC33C
OCR Text	... Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperat...
Description	UNBUMPED FLIP CHIP ARRAY
File Size	102.32K / 6 Page	View it Online	Download Datasheet

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Part No.	U0408FC36C U0408FC05C U0408FC08C U0408FC12C U0408FC15C U0408FC24C U0408FC3.3C U0408FC33C
OCR Text	... Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperat...
Description	UNBUMPED FLIP CHIP ARRAY
File Size	105.62K / 6 Page	View it Online	Download Datasheet

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Part No.	ULC0402FC36C ULC0402FC05C ULC0402FC12C ULC0402FC15C ULC0402FC24C ULC0402FC3.3C ULC0402FC33C ULC0402FC08C
OCR Text	... Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperat...
Description	UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
File Size	96.36K / 5 Page	View it Online	Download Datasheet

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Part No.	ULC0404FC36C ULC0404FC05C ULC0404FC08C ULC0404FC12C ULC0404FC15C ULC0404FC24C ULC0404FC3.3C ULC0404FC33C
OCR Text	... Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperat...
Description	UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
File Size	109.29K / 6 Page	View it Online	Download Datasheet

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Part No.	ULC0406FC36C ULC0406FC05C ULC0406FC08C ULC0406FC12C ULC0406FC15C ULC0406FC24C ULC0406FC3.3C ULC0406FC33C
OCR Text	... Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperat...
Description	UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
File Size	113.01K / 6 Page	View it Online	Download Datasheet

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Part No.	ULC0408FC36C ULC0408FC05C ULC0408FC08C ULC0408FC12C ULC0408FC15C ULC0408FC24C ULC0408FC3.3C ULC0408FC33C
OCR Text	... Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperat...
Description	UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
File Size	116.10K / 6 Page	View it Online	Download Datasheet

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Part No.	ULLC0402FC33C ULLC0402FC05C ULLC0402FC08C ULLC0402FC12C ULLC0402FC15C ULLC0402FC24C ULLC0402FC3.3C
OCR Text	... Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperat...
Description	UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
File Size	96.22K / 5 Page	View it Online	Download Datasheet

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Part No.	ULLC0408FC05C
OCR Text	... Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperat...
Description	UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
File Size	106.00K / 5 Page	View it Online	Download Datasheet

For 325mm Found Datasheets File :: 214 Search Time::0.703ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |